German technology company Bosch has officially introduced its third-generation Silicon Carbide (SiC) semiconductors to the Indian market. The strategic rollout targets the next phase of India's electric vehicle (EV) expansion, shifting the market focus from early adoption toward cost efficiency, longer ranges, and mass-market scaling.

Silicon carbide technology has become a cornerstone of modern EV drivetrains, acting as the primary control mechanism for energy flow within the power electronics system – specifically the inverter. By optimising the conversion of direct current (DC) from the battery into alternating current (AC) for the electric motor, SiC chips directly dictate a vehicle's overall electrical efficiency.

The Gen 3 SiC chips bring several structural and performance improvements over legacy silicon and previous-generation components by delivering around 20 percent higher performance, enabling electric vehicles to achieve extended driving ranges without requiring automakers to increase physical battery pack sizes.

The SiC chips are manufactured using an advanced substrate, which reduces switching energy losses and improves thermal performance. This allows for less complex, more lightweight cooling architectures within the engine bay.

Enhanced miniaturisation allows Bosch to harvest more individual chips per semiconductor wafer, lowering manufacturing cost barriers and making advanced power electronics financially viable for mass-market budget EVs, two-wheelers and commercial fleets.

To date, Bosch has delivered more than 60 million SiC chips worldwide. The multinational engineering firm continues to funnel billions of euros into expanding its global semiconductor fabrication plants to reinforce supply line resilience against global automotive chip shortages.

By introducing the third-generation lineup locally, Bosch aims to establish an end-to-end semiconductor ecosystem in India, backing the government's localized advanced manufacturing and vehicle electrification goals.

Sandeep Nelamangala, Joint Managing Director, Bosch and President of Bosch Mobility India, said, “Our advanced SiC technology is designed to deliver the tangible benefits that Indian consumers demand - longer driving range, faster charging, and lower long-term costs. By making high-efficiency power electronics more accessible, we are helping to unlock the full potential of the EV market, making clean, efficient mobility a reality for everyone in India."

Markus Heyn, Member of the Bosch Board of Management, and Chairman, Bosch Mobility business sector, said, “Our ambition is clear: we want to be a globally leading manufacturer of SiC chips. With our next generation SiC chips, we are helping our customers put even more powerful and efficient electric vehicles onto the road.”

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NXP Semiconductors has announced that the BMW Group will deploy its Trimension NCJ29D6 Ultra-Wideband (UWB) family across its vehicle fleet, beginning with selected 2026 production programmes.

The hardware component integrates fine-ranging capabilities with short-range radar functionality on a single chip. This allows vehicle manufacturers to utilise a single system for multiple applications, including hands-free vehicle entry and occupant presence detection.

The integration supports BMW’s Digital Key Plus feature, which enables vehicle owners to substitute key fobs with smartphones or smartwatches. The system manages locking and unlocking functions as the user approaches or moves away from the vehicle. Additionally, the technology includes in-cabin radar monitoring designed to identify motion patterns consistent with occupants or animals left inside a parked vehicle, sending notification alerts to users to align with European and Chinese NCAP assessment protocols.

Markus Staeblein, Senior Vice-President and General Manager, Secure Car Access at NXP Semiconductors, said, “NXP’s proven Trimension UWB platform maximises value for OEMs, using a single system to deliver multiple new and differentiating features for drivers. Digital key and presence detection are just the beginning. OEMs will be able to deliver additional UWB-based features, such as kick sensing, intrusion alert or automatic charging, as they establish the secure hardware platform in their vehicles.”

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Envalior India, an engineering materials company formed through the merger of DSM Engineering Materials and LANXESS High Performance Materials, will inaugurate the Envalior Centre of Excellence in Electric Vehicle Technology on 5 August 2026 as part of its corporate social responsibility (CSR) program.

The CoE located at Marathwada Mitra Mandal's Polytechnic in Pimpri-Chinchwad, Pune, will be implemented by the BroadArks Foundation to provide vocational training in electric vehicle systems.

It plans to train 250 individuals annually through two courses: a Level 4 Certificate in EV Service, Safety & Maintenance and a Level 5 Advanced Certificate in EV Diagnostics & Systems.

The curricula align with the National Skills Qualifications Framework and carry certification support from the Confederation of Indian Industry. The programs target students from Industrial Training Institutes and polytechnics studying mechanical, electrical, electronics, mechatronics and computer science disciplines.

Training instruction covers classroom coursework and laboratory modules focused on vehicle architecture, battery management systems, charging infrastructure, thermal management, power electronics, diagnostics and workshop safety protocols. Practical assessments and industry projects form part of the curriculum structure.

Nileshkumar Kukalyekar, Business Director – South Asia, Middle East & Africa, Envalior, said, "The launch of the Envalior Centre of Excellence reflects our commitment to supporting India's transition towards electric mobility by investing in the people who will power it. Through this Centre, we aim to provide students with industry-aligned, hands-on training that prepares them for the evolving demands of the EV sector while contributing to a stronger and future-ready workforce."

In addition to student instruction, the facility is designed to support laboratory infrastructure and instructor development programs for technical education in the region.

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South Korean auto major Hyundai Motor Group has appointed Junghyun Kwon as Executive Vice-President and Head of the Autonomous Driving Development Center.

Kwon will oversee software engineering, deep learning integration, perception systems and commercialisation pathways for the group's autonomous mobility programs, reporting directly to Minwoo Park, President and Head of the Advanced Vehicle Platform (AVP) Division.

He joins the group following technical management roles in software development and artificial intelligence across international technology firms. Kwon previously managed autonomous driving software development and deployment at NVIDIA before directing intelligent robotics development at Samsung Electronics. His technical background covers machine learning models, computer vision systems and vehicle perception frameworks.

The executive appointment forms part of a broader recruitment sequence targeting software-defined vehicle architectures and autonomous driving systems.

Earlier in July, Hyundai Motor Group appointed Dongwuk Kim as Senior Vice-President and Head of the SDV Platform Development Center, following his work on wireless communication systems for mobile devices, robotics and vehicles at Apple and Tesla. The group also added Jeremy Ma as Senior Vice-President and Head of AVP Silicon Valley, drawing on his experience in robotics and autonomous systems at Apple, Toyota Research Institute and NVIDIA.

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Automechanika Frankfurt, one of the leading automotive aftermarket trade fairs, will introduce a technology exchange platform, named ‘HighTech4Mobility’, in September 2026.

The format will address the impact of software-defined vehicles, connected platforms, and artificial intelligence on vehicle maintenance, parts distribution and aftersales business models.

The event will gather original equipment manufacturers, Tier-1 suppliers, software companies, investors and workshop representatives at the Festhalle venue. Program topics encompass software architectures, advanced driver assistance systems, autonomous driving, cybersecurity, data management and digital services. Discussions will evaluate how vehicle data access, over-the-air software updates, and predictive diagnostics alter traditional repair and service workflows.

Olaf Mubhoff, Director, Automechanika Frankfurt, said, “The pace of technological development in the mobility sector is breathtaking. This means it is more important than ever that developments are quickly recognised and understood, so that people can share their experiences and assess the opportunities presented by new technologies. HighTech4Mobility addresses this need by providing a forum for exchange between key industry players.”

The event schedule includes joint presentations on artificial intelligence applications in aftersales by the IBM Institute for Business Value, Google Cloud and the Boston Consulting Group.

Benteler Mobility will present developments in autonomous driving and robotics, while German digital association Bitkom will conduct sessions on cybersecurity in software-defined vehicles. Additionally, the Technical University of Braunschweig will provide two demonstration vehicles to test vehicle monitoring software.

The platform follows a series of pre-fair events, including the HEY/PIONEER receptions in Berlin and Las Vegas, the Innovation4Mobility Talk in Munich and webinars hosted with industry partners.

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