Texas Instruments unveiled four integrated automotive chips in a virtual event, designed to reimagine in-cabin experience for both drivers and passengers. The high-tech chips were also showcased at the Consumer Electronics Show 2025 held in Las Vegas. The line-up included the AWRL6844 millimetre-wave radar sensor with AI-enhanced safety features, the AM275x-Q1 MCUs and the AM62D-Q1- a family of MCUs featuring the powerful C7X DSP core for premium audio- and the innovative TAS6754-Q1 audio amplifier with proprietary 1L modulation technology.

Alluding to the matter, a company official said, “The new-age automotive chips centre around advanced driver assistance systems (ADAS) and infotainment and cluster. As consumers, we expect a lot from our vehicles and this innovation is driven by two key factors. First, new government regulations and car assessment programmes mandate improvements in passenger safety, requiring more accurate and robust in-cabin sensing systems to monitor a variety of situations. Second, there is a growing demand for premium audio experiences as in-car systems now often surpass home audio systems in quality, delivering unparalleled experiences across a wide range of vehicles.”

“Our silicon solutions are designed to empower designers to enhance the overall in-vehicle experience without compromise. To that end, we are excited to debut three new automotive products,” he added.

Radar sensor

The AWRL6844 is designed to help customers deliver a safe and feature-rich user experience. It aims to enhance the user experience visually and improve safety. The company highlighted that OEMS face challenges in meeting stringent requirements while minimising cost and design complexity. Moreover, requirements for transference detection would award points only for direct sensing systems capable of detecting the presence of a human inside a vehicle by tracking signs of life such as artery aspiration rates and movements. Future in-cabin sensing systems would need to accurately differentiate between children and adults to enhance user experience and safety.

The AWRL6844 is the industry’s first single-chip solution that supports these three key applications, which has been achieved through the integration of AI into the silicon, claimed the company.

The sensor integration was said to provide optimal spatial resolution, delivering dense point cloud data for applications in a cost-effective manner while leveraging edge AI processing. This high-resolution data feeds into AI-driven algorithms on a customisable, on-chip auto accelerator and DSP, enabling local data processing. This approach, allows automotive systems to achieve advanced sensing with a single chip solution, reducing system cost and complexity.

The AWRL6844 will help OEMs could deliver seamless detection, validation and classification, simplifying sensing topologies and modalities used today or in the future.

For instance, the system can detect localised occupants with up to 98 percent accuracy to minimise detection errors. This eliminates uncertainty related to seatbelt detection when a non-human object is on the seat. When the car is parked, the sensor uses neural networks to classify adults and children with high accuracy, trained to detect micro-movements and distinguish between them. The device also enhances detection in blind spots, preventing children from being left unattended in vehicles.

Audio processor

On the other hand, the AM275x-Q1 MCU and AM62D-Q1 processors enable leveraging advanced audio features that enhance in-cabin experience. Another company official noted, “Audio is increasingly used in cars to enhance safety with features like door chimes and seatbelt reminders as well as to improve passenger comfort across vehicle fleets. These features are no longer limited to luxury vehicles. Our solutions bring premium audio capabilities across the entire OEM vehicle line-up, leveraging a unified software investment.” 

“At the core of this innovation our C7x DSP core. It supports a higher number of speakers and multiple audio zones, delivering high-quality sound throughout the vehicle. The C7x DSP achieves 4-8 times the processing performance of competing devices, enabling the management of multiple audio features within a single core, thus reducing the need for external components,” the official added.

The C7x DSP’s performance is made possible by its 256-bit vector architecture and single-cycle memory access, alongside pipeline optimisations that drive industry-leading audio benchmarks. Additionally, the integrated neural processing unit allows customers to develop and execute AI algorithms on the same platform. This high processing capability reduces component requirements for automotive audio systems while enabling advanced features like real-time tuning, spatial audio and latency-reduced ANC. 

“This is especially critical for EVs, which often lack passive sound-dampening materials, relying instead on active solutions to maintain cabin quietness. TI’s solutions also support Acoustic Vehicle Alerting Systems (AVAS) for external pedestrian alerts, making them integral to modern EV designs,” added the official.

The AM275x-Q1 MCU is a DDR-less single-chip solution tailored for high-performance audio applications, supporting up to 32 channels. Its integrated 4.5 MB SRAM and up to 6 MB L3 memory eliminate the need for external memory, reducing system complexity. In contrast, the AM62D-Q1 processor is DDR-based and suited for applications requiring large memory sizes such as high-resolution playback or simultaneous AI and audio processing. With a high-speed DDR4 controller, it ensures real-time compute capabilities and smooth performance. 

The company claimed that both chips will enable engineers to design premium audio systems with minimal investment in hardware and software. 

The TAS6754-Q1 Class D amplifier’s modulation technology reduces the number of required inductors by half. This advancement enables more compact, lightweight and cost-efficient designs without compromising audio quality. Additionally, the amplifier incorporates real-time load diagnostics, streamlining design processes and enhancing efficiency to meet OEM demands effectively.

Commenting on the new products, Senior Vice President of TI’s Embedded Processing Amichai Ron said, “Today’s drivers expect any car – entry-level to luxury, combustion to electric – to have enhanced in-cabin experiences. TI continues to provide innovative technologies to enable the future of the automotive driving experience. Our edge AI-enabled radar sensors allow automakers to make vehicles safer and more responsive to the driver, while our audio systems-on-chip elevate the drive through more immersive audio. Together they create a whole new level of in-cabin experiences.”

The chips are available at the company’s website.

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Schaeffler, a motion technology company, will showcase its range of electrified powertrain technologies at the 13th Schaeffler Automotive Symposium in Buhl this June.

The event, themed ‘Beyond Driving. Innovation made by Schaeffler.’, will highlight solutions for the entire spectrum of drive systems, including battery electric vehicles (BEV), plug-in hybrids (PHEV), hybrid electric vehicles (HEV) and range extender applications (REEV).

In the battery electric segment, the company focuses on highly integrated and scalable systems. The key developments include system integration, which combines e-axles, drive units and software to create efficient overall systems. Scalable inverter solutions platforms with X-in-1 functionality designed for faster time-to-market and lower costs. Enhancing electric motors and bearings – such as current-insulated variants – through material efficiency and modern manufacturing. Lastly, streamlining development using new approaches to reduce product complexity and accelerate market readiness.

For the hybrid and range extender architectures, Schaeffler will present technologies designed for diverse hybrid topologies, ranging from P1 to P3 systems. These solutions include:

• Dedicated Hybrid Transmissions: An all-in-one platform for hybrid and plug-in hybrid vehicles that integrates software and mechanical components.
• Range Extenders: Systems that utilise internal combustion engines more efficiently to support the ongoing transition to electric mobility.
• Seamless Integration: High-performance actuators and sensors used to make engine operation quiet and clean for vehicle occupants.
• Platform Compatibility: Designs that can be integrated into existing vehicle architectures while meeting cost and performance requirements.

Matthias Zink, CEO, Powertrain & Chassis, Schaeffler, said, “With our Powertrain technology cluster, we will be showcasing Schaeffler’s extensive development capabilities in the powertrain segment at the Schaeffler Automotive Symposium. We offer all customers the entire spectrum of powertrain technologies – from components to functionally integrated systems.”

Thomas Stierle, CEO, E-Mobility, Schaeffler, added, “Our expertise in mechanical engineering, electronics and software enables us to develop scalable system solutions. Thanks to a consistently integrated approach, Schaeffler is developing electric powertrains that optimally combine efficiency, a compact footprint, functionality, sustainability and industrialization.”

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Sundram Fasteners has announced that it achieved its highest ever annual revenue, EBITDA and profits in FY2026. The company surpassed the INR 60 billion consolidated income milestone during this period.

For FY2026, the company’s consolidated income reached INR 63.68 billion, EBITDA at INR 1.07 billion and net profit of INR 5.92 billion.

In Q4 FY2026, the income came at INR 15.29 billion, up 12 percent YoY, domestic sales grew by 14 percent at INR 10.28 billion, net profit of INR 1.79 billion, up 34 percent YoY.

In FY2026, Sundram Fasteners incurred INR 4.04 billion in capital expenditure to expand capacity for existing business lines and new projects.

Growth was supported by momentum in non-auto segments, including wind energy, aerospace and railways. In the automotive sector, sales were bolstered by the North American Class 8 truck market and internal combustion engine (ICE) vehicle sales.

Arathi Krishna, Managing Director, Sundram Fasteners, said, “Our performance this quarter reflects the strength of our operational discipline and our unwavering focus on customer centricity. Despite a challenging global environment marked by geopolitical uncertainties, we have delivered all-time high results driven by robust domestic demand and improved efficiencies. We continue to see strong momentum in our non-auto segments such as wind energy, aerospace, and railways, which provide significant headroom for future growth. Additionally, new business wins across geographies have enabled us to further expand our global footprint. The uptick in North American Class 8 truck and ICE vehicle sales has supported growth in our automotive portfolio, while our strategic shift to directly engage with OEMs outside India in the fasteners division has enhanced both margins and market access, even amid broader industry sluggishness.”

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Tier 1 automotive supplier Sona BLW Precision Forgings (Sona Comstar) has announced its financial results Q4 FY2026 and FY2026, reporting its highest levels of revenue and profitability to date.  The company recorded growth in its electric vehicle segment, with revenue from battery electric vehicles (BEVs) contributing 39 percent share for FY2026.

For Q4 FY2026, the revenue grew by 47 percent YoY to reach INR 12.72 billion, EBITDA at INR 3.11 billion, up 32 percent YoY, PAT at INR 1.92 billion, an uptick of 17 percent YoY. Interestingly, revenue from battery electric vehicles program reached INR 3.59 billion, marking a 22 percent YoY increase.

During the quarter, the company secured four driveline programs. This included three orders from European manufacturers, marking the first time the firm has won three such contracts in a single quarter. These programs include:

• North American BEV Program: An order from a European manufacturer to supply gears, adding INR 2.2 billion to the order book.
• European BEV Program: A contract from a luxury manufacturer for assemblies, valued at INR 1.4 billion.
• Hybrid Platform: An INR 1.2 billion order from a European client for assemblies.
• Indian BEV Platform: An INR 1 billion order to supply assemblies for the Indian market.

For the full financial year, Sona Comstar recorded revenue of INR 44.75 billion, up 26 percent as compared to FY2026.  EBITDA for the year stood at INR 11.07 billion with a margin of 24.7 percent. The company expanded its portfolio by adding nine new electric vehicle programs and three customers, bringing its total to 67 programs across 35 customers.

Vivek Vikram Singh, MD & Group CEO, said, “Q4 FY26 was our strongest quarter financially and an important step forward in our strategic and technology roadmap, with new customers added in Europe and two new railway products commercialised. We delivered our best-ever quarter, with the highest revenue, EBITDA, PAT, BEV revenue and BEV revenue share. Revenue grew by 47 percent YoY, primarily driven by growth in EV traction and suspension motors, differential gears, differential assemblies along with consolidation of railway business. BEV revenue grew 22 percent YoY and BEV revenue share reached an all-time high of 39 percent. During the quarter, we won four driveline orders which includes three EV programs and one hybrid program. For the first time, we won three orders from European OEMs, and this is our first EV program win from Europe in almost four years. The hybrid program wins reinforce our view that hybrids are an opportunity for us, not a risk.”

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Tier 1 component and technology company Schaeffler India has announced its financial results for the Q1 CY2026, maintaining double-digit growth momentum across its primary business segments.

For Q1 CY2026, the company reported an 18.8 percent YoY uptick in revenue at INR 25 billion with a net profit margin of INR 3.19 billion, up 19.3 percent YoY.

The company attributed the robust results to strong performance in Automotive Technologies and Vehicle Lifetime Solutions, which fuelled stable earnings quality to increased localisation and improved capital efficiency.

While revenue grew significantly compared to the same period last year, it saw a marginal decline of 5.1 percent compared to the preceding quarter (Q4 CY2025).

Harsha Kadam, Managing Director and Chief Executive Officer, said, “We are pleased to report continued strong growth momentum across all our business segments. Automotive Technologies, Vehicle Lifetime Solutions, and Exports delivered robust double-digit growth, driven by successful business wins in our key focus areas. Despite ongoing supply chain challenges and inflationary headwinds, we successfully maintained the quality of our earnings. This reflects the effectiveness of our strategic focus on localisation and capital efficiency. We remain fully committed to achieving our financial and operational targets, capitalising on market opportunities and delivering consistent value to our stakeholders.”

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