Texas Instruments unveiled four integrated automotive chips in a virtual event, designed to reimagine in-cabin experience for both drivers and passengers. The high-tech chips were also showcased at the Consumer Electronics Show 2025 held in Las Vegas. The line-up included the AWRL6844 millimetre-wave radar sensor with AI-enhanced safety features, the AM275x-Q1 MCUs and the AM62D-Q1- a family of MCUs featuring the powerful C7X DSP core for premium audio- and the innovative TAS6754-Q1 audio amplifier with proprietary 1L modulation technology.

Alluding to the matter, a company official said, “The new-age automotive chips centre around advanced driver assistance systems (ADAS) and infotainment and cluster. As consumers, we expect a lot from our vehicles and this innovation is driven by two key factors. First, new government regulations and car assessment programmes mandate improvements in passenger safety, requiring more accurate and robust in-cabin sensing systems to monitor a variety of situations. Second, there is a growing demand for premium audio experiences as in-car systems now often surpass home audio systems in quality, delivering unparalleled experiences across a wide range of vehicles.”

“Our silicon solutions are designed to empower designers to enhance the overall in-vehicle experience without compromise. To that end, we are excited to debut three new automotive products,” he added.

Radar sensor

The AWRL6844 is designed to help customers deliver a safe and feature-rich user experience. It aims to enhance the user experience visually and improve safety. The company highlighted that OEMS face challenges in meeting stringent requirements while minimising cost and design complexity. Moreover, requirements for transference detection would award points only for direct sensing systems capable of detecting the presence of a human inside a vehicle by tracking signs of life such as artery aspiration rates and movements. Future in-cabin sensing systems would need to accurately differentiate between children and adults to enhance user experience and safety.

The AWRL6844 is the industry’s first single-chip solution that supports these three key applications, which has been achieved through the integration of AI into the silicon, claimed the company.

The sensor integration was said to provide optimal spatial resolution, delivering dense point cloud data for applications in a cost-effective manner while leveraging edge AI processing. This high-resolution data feeds into AI-driven algorithms on a customisable, on-chip auto accelerator and DSP, enabling local data processing. This approach, allows automotive systems to achieve advanced sensing with a single chip solution, reducing system cost and complexity.

The AWRL6844 will help OEMs could deliver seamless detection, validation and classification, simplifying sensing topologies and modalities used today or in the future.

For instance, the system can detect localised occupants with up to 98 percent accuracy to minimise detection errors. This eliminates uncertainty related to seatbelt detection when a non-human object is on the seat. When the car is parked, the sensor uses neural networks to classify adults and children with high accuracy, trained to detect micro-movements and distinguish between them. The device also enhances detection in blind spots, preventing children from being left unattended in vehicles.

Audio processor

On the other hand, the AM275x-Q1 MCU and AM62D-Q1 processors enable leveraging advanced audio features that enhance in-cabin experience. Another company official noted, “Audio is increasingly used in cars to enhance safety with features like door chimes and seatbelt reminders as well as to improve passenger comfort across vehicle fleets. These features are no longer limited to luxury vehicles. Our solutions bring premium audio capabilities across the entire OEM vehicle line-up, leveraging a unified software investment.” 

“At the core of this innovation our C7x DSP core. It supports a higher number of speakers and multiple audio zones, delivering high-quality sound throughout the vehicle. The C7x DSP achieves 4-8 times the processing performance of competing devices, enabling the management of multiple audio features within a single core, thus reducing the need for external components,” the official added.

The C7x DSP’s performance is made possible by its 256-bit vector architecture and single-cycle memory access, alongside pipeline optimisations that drive industry-leading audio benchmarks. Additionally, the integrated neural processing unit allows customers to develop and execute AI algorithms on the same platform. This high processing capability reduces component requirements for automotive audio systems while enabling advanced features like real-time tuning, spatial audio and latency-reduced ANC. 

“This is especially critical for EVs, which often lack passive sound-dampening materials, relying instead on active solutions to maintain cabin quietness. TI’s solutions also support Acoustic Vehicle Alerting Systems (AVAS) for external pedestrian alerts, making them integral to modern EV designs,” added the official.

The AM275x-Q1 MCU is a DDR-less single-chip solution tailored for high-performance audio applications, supporting up to 32 channels. Its integrated 4.5 MB SRAM and up to 6 MB L3 memory eliminate the need for external memory, reducing system complexity. In contrast, the AM62D-Q1 processor is DDR-based and suited for applications requiring large memory sizes such as high-resolution playback or simultaneous AI and audio processing. With a high-speed DDR4 controller, it ensures real-time compute capabilities and smooth performance. 

The company claimed that both chips will enable engineers to design premium audio systems with minimal investment in hardware and software. 

The TAS6754-Q1 Class D amplifier’s modulation technology reduces the number of required inductors by half. This advancement enables more compact, lightweight and cost-efficient designs without compromising audio quality. Additionally, the amplifier incorporates real-time load diagnostics, streamlining design processes and enhancing efficiency to meet OEM demands effectively.

Commenting on the new products, Senior Vice President of TI’s Embedded Processing Amichai Ron said, “Today’s drivers expect any car – entry-level to luxury, combustion to electric – to have enhanced in-cabin experiences. TI continues to provide innovative technologies to enable the future of the automotive driving experience. Our edge AI-enabled radar sensors allow automakers to make vehicles safer and more responsive to the driver, while our audio systems-on-chip elevate the drive through more immersive audio. Together they create a whole new level of in-cabin experiences.”

The chips are available at the company’s website.

Norway-headquartered automotive component supplier Kongsberg Automotive has inaugurated its new manufacturing facility in Faridabad, India.

The Norwegian company is a leading supplier of driver and motion control systems, fluid assemblies and industrial driver interface products. It primarily caters to on-highway, passenger cars, off-highway and aftermarket segments.

The company has established its presence in 17 countries globally, employs over 4,700 people in 32 locations and clocked EUR 788 million revenue in 2024.

The new facility primarily manufactures Drive Control Systems (DCS) products – steering columns, cable gear shifters, shift towers and shift-by-wire shifters, among others. Furthermore, the new facility will allow Kongsberg Automotive to expand its production capability for Flow Control Systems (FCS) products.

Robert Pigg, Executive Vice-President of Drive Control Systems, Kongsberg Automotive, said, “This relocation represents a significant step in Kongsberg Automotive’s ongoing journey toward growth and enhanced manufacturing excellence in India.”

The new facility is spread across 6,947 square metres, as compared to its previous plant in the same locality.

CK Holdings-owned Italian automotive tier 1 supplier Marelli has won three accolades at the 2025 Automotive News PACE Awards.

The company won awards for Innovation Partnership Award for Digital OLED Taillights, PACE Award for Digital OLED 2.0 Technology and PACEpilot Award for Electromechanical Suspension.

The first award jointly received by Marelli and Audi for their collaboration on the Digital OLED Taillight, featured on the 2024 Audi Q6 e-tron. The award highlights successful supplier-OEM partnerships in commercialising advanced technologies.

The second-generation Digital OLED Taillight allows drivers to personalise their vehicle with up to eight light signatures via the MMI or myAudi app. It also enhances safety through proximity indication and vehicle-to-everything (V2X) communication, displaying warning symbols in critical situations.

Frank Huber, President, Marelli’s Lighting business, said, “This award reflects our commitment to co-creating innovations with partners like Audi.”

The second award was won jointly by Marelli and OLEDWorks for the Digital OLED 2.0 rear lights on the Audi Q6 e-tron. The technology uses 60-segment OLED panels, controlled via a high-speed CAN-FD bus, enabling dynamic light signatures and improved safety features.

The system reduces mechanical complexity, increases energy efficiency and supports advanced animations. Steve Muench, Head of Marelli Lighting North America, and David DeJoy, CEO of OLEDWorks, accepted the award.

Lastly, Marelli was recognised for its Fully Active Electromechanical Suspension, which received a PACEpilot Award for its potential to transform future mobility. The oil-free system uses four actuators to adjust suspension in real-time, improving comfort and efficiency while reducing motion sickness.

Antonio Ferrara, President, Marelli’s Ride Dynamics business, said: “This award acknowledges our commitment to advancing vehicle dynamics for electric and autonomous vehicles.”

Hindustan Zinc Limited, India’s only and the world's largest integrated zinc producer, has launched Zinc Freight Bazaar, a digital-first logistics management system aimed at empowering customers, enhancing experience and simplifying the overall logistics process.

Zinc Freight Bazaar, which was created with a strong emphasis on user experience, makes it possible for clients to make knowledgeable logistical decisions and supports efficient production planning. The platform is designed to satisfy its users' complex needs. The platform offers a number of associated logistics service providers, real-time tracking, a logistics planner and a bidding mechanism. Customers had to switch between many systems for shipment monitoring and logistics coordination in the traditional zinc procurement process, but this new platform provides a simplified, end-to-end digital solution that enables business teams to easily acquire vital metals.

As a vital component of galvanisation, zinc protects steel from corrosion and supports vital sectors including electronics, renewable energy, infrastructure, high-tech manufacturing, defence and electric mobility. London Metal Exchange (LME)-registered premium products such as Special High-Grade Zinc, High Grade Zinc, Asia's first low carbon ‘green’ zinc EcoZen, Prime Western Zinc, Continuous Galvanizing Grade Zinc, Special High Grade Jumbo Zinc, High Grade Jumbo Zinc, Hindustan Zinc Die Casting Alloy 3, Hindustan Zinc Die Casting Alloy 5 and Special High-Grade Lead are among the products offered by Hindustan Zinc.

Arun Misra, CEO, Hindustan Zinc Limited, said, “At Hindustan Zinc, we have always prioritised a customer-first approach to enhance the critical metal buying experience. With the integration of digitalisation, we are taking a decisive step forward in delivering a seamless, tech-enabled experience. This platform simplifies procurement and reinforces our commitment to building a future-ready supply chain. As India’s economy continues to expand, the role of zinc in infrastructure development becomes increasingly vital. This platform will empower manufacturers with improved production planning while providing a unified solution for logistics management.”

ZF Commercial Vehicle Solutions, a division of German tier 1 supplier ZF Group, has recently secured a multi-year business order from one of India’s leading commercial vehicle manufacturers for supply of AxTrax 2 Electric Axles.

As part of the understanding, ZF will supply its AxTrax 2, an integrated and modular electric axle for medium duty buses, which the company said provides a more efficient, high-performance solution. The contract covers a supply of several thousand units over multiple years.

The AxTrax 2 electric axle is designed to replace the engine, transmission and conventional axle to electrify a commercial vehicle. It is part of ZF’s modular e-mobility kit, which integrates in-house developed components into an innovative axle-based solution that is efficient, compact and lightweight in design.

Akash Passey, President, ZF Group in India, said, “ZF Group has an established presence in India's commercial vehicle sector, consistently leading the charge in pioneering advanced technology solutions that enhance safety, efficiency, and sustainability in mobility. This business nomination highlights our pivotal role in delivering innovative mobility solutions tailored to meet the evolving needs of our OEM partners.”.

P Kaniappan, Senior Vice-President – CVS Division (India), ZF Group, added, "AxTrax 2 represents evolution of our journey towards market leadership and sustainability for the next generation of mobility in India. This milestone reinforces ZF Group’s position as the industry leader in e-mobility while delivering significant advancements for both our customers and the Indian market."