Texas Instruments unveiled four integrated automotive chips in a virtual event, designed to reimagine in-cabin experience for both drivers and passengers. The high-tech chips were also showcased at the Consumer Electronics Show 2025 held in Las Vegas. The line-up included the AWRL6844 millimetre-wave radar sensor with AI-enhanced safety features, the AM275x-Q1 MCUs and the AM62D-Q1- a family of MCUs featuring the powerful C7X DSP core for premium audio- and the innovative TAS6754-Q1 audio amplifier with proprietary 1L modulation technology.

Alluding to the matter, a company official said, “The new-age automotive chips centre around advanced driver assistance systems (ADAS) and infotainment and cluster. As consumers, we expect a lot from our vehicles and this innovation is driven by two key factors. First, new government regulations and car assessment programmes mandate improvements in passenger safety, requiring more accurate and robust in-cabin sensing systems to monitor a variety of situations. Second, there is a growing demand for premium audio experiences as in-car systems now often surpass home audio systems in quality, delivering unparalleled experiences across a wide range of vehicles.”

“Our silicon solutions are designed to empower designers to enhance the overall in-vehicle experience without compromise. To that end, we are excited to debut three new automotive products,” he added.

Radar sensor

The AWRL6844 is designed to help customers deliver a safe and feature-rich user experience. It aims to enhance the user experience visually and improve safety. The company highlighted that OEMS face challenges in meeting stringent requirements while minimising cost and design complexity. Moreover, requirements for transference detection would award points only for direct sensing systems capable of detecting the presence of a human inside a vehicle by tracking signs of life such as artery aspiration rates and movements. Future in-cabin sensing systems would need to accurately differentiate between children and adults to enhance user experience and safety.

The AWRL6844 is the industry’s first single-chip solution that supports these three key applications, which has been achieved through the integration of AI into the silicon, claimed the company.

The sensor integration was said to provide optimal spatial resolution, delivering dense point cloud data for applications in a cost-effective manner while leveraging edge AI processing. This high-resolution data feeds into AI-driven algorithms on a customisable, on-chip auto accelerator and DSP, enabling local data processing. This approach, allows automotive systems to achieve advanced sensing with a single chip solution, reducing system cost and complexity.

The AWRL6844 will help OEMs could deliver seamless detection, validation and classification, simplifying sensing topologies and modalities used today or in the future.

For instance, the system can detect localised occupants with up to 98 percent accuracy to minimise detection errors. This eliminates uncertainty related to seatbelt detection when a non-human object is on the seat. When the car is parked, the sensor uses neural networks to classify adults and children with high accuracy, trained to detect micro-movements and distinguish between them. The device also enhances detection in blind spots, preventing children from being left unattended in vehicles.

Audio processor

On the other hand, the AM275x-Q1 MCU and AM62D-Q1 processors enable leveraging advanced audio features that enhance in-cabin experience. Another company official noted, “Audio is increasingly used in cars to enhance safety with features like door chimes and seatbelt reminders as well as to improve passenger comfort across vehicle fleets. These features are no longer limited to luxury vehicles. Our solutions bring premium audio capabilities across the entire OEM vehicle line-up, leveraging a unified software investment.” 

“At the core of this innovation our C7x DSP core. It supports a higher number of speakers and multiple audio zones, delivering high-quality sound throughout the vehicle. The C7x DSP achieves 4-8 times the processing performance of competing devices, enabling the management of multiple audio features within a single core, thus reducing the need for external components,” the official added.

The C7x DSP’s performance is made possible by its 256-bit vector architecture and single-cycle memory access, alongside pipeline optimisations that drive industry-leading audio benchmarks. Additionally, the integrated neural processing unit allows customers to develop and execute AI algorithms on the same platform. This high processing capability reduces component requirements for automotive audio systems while enabling advanced features like real-time tuning, spatial audio and latency-reduced ANC. 

“This is especially critical for EVs, which often lack passive sound-dampening materials, relying instead on active solutions to maintain cabin quietness. TI’s solutions also support Acoustic Vehicle Alerting Systems (AVAS) for external pedestrian alerts, making them integral to modern EV designs,” added the official.

The AM275x-Q1 MCU is a DDR-less single-chip solution tailored for high-performance audio applications, supporting up to 32 channels. Its integrated 4.5 MB SRAM and up to 6 MB L3 memory eliminate the need for external memory, reducing system complexity. In contrast, the AM62D-Q1 processor is DDR-based and suited for applications requiring large memory sizes such as high-resolution playback or simultaneous AI and audio processing. With a high-speed DDR4 controller, it ensures real-time compute capabilities and smooth performance. 

The company claimed that both chips will enable engineers to design premium audio systems with minimal investment in hardware and software. 

The TAS6754-Q1 Class D amplifier’s modulation technology reduces the number of required inductors by half. This advancement enables more compact, lightweight and cost-efficient designs without compromising audio quality. Additionally, the amplifier incorporates real-time load diagnostics, streamlining design processes and enhancing efficiency to meet OEM demands effectively.

Commenting on the new products, Senior Vice President of TI’s Embedded Processing Amichai Ron said, “Today’s drivers expect any car – entry-level to luxury, combustion to electric – to have enhanced in-cabin experiences. TI continues to provide innovative technologies to enable the future of the automotive driving experience. Our edge AI-enabled radar sensors allow automakers to make vehicles safer and more responsive to the driver, while our audio systems-on-chip elevate the drive through more immersive audio. Together they create a whole new level of in-cabin experiences.”

The chips are available at the company’s website.

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Chennai-based Sundram Fasteners has announced its unaudited financial results for Q1 FY2026, which saw the company report record profits and strong revenue growth. The company reported its highest-ever standalone revenue from operations at INR 13.50 billion, a slight increase from INR 13.10 billion a year ago.

The growth was primarily fuelled by a robust domestic market, with domestic sales rising 8.78 percent to INR 9.30 billion. However, export sales faced challenges, declining to INR 3.79 billion. Despite this, the company achieved its highest-ever EBITDA of INR 2.38 billion, with an improved margin of 17.5 percent, a result of better operational efficiency, stable commodity prices, and a favourable product mix.

Sundram Fasteners also posted its recorded net profit of INR 1.38 billion for the quarter. Consolidated figures also showed a strong performance, with the company recording its highest-ever consolidated revenue from operations at INR 15.33 billion and a consolidated net profit of INR 1.47 billion.

Arathi Krishna, Managing Director, Sundram Fasteners, said, "I am pleased to share that our first-quarter performance underscores the fundamental strength and resilience of our operations, as well as our unwavering commitment to delivering value to our customers. Compared to the same period last year, we have grown propelled primarily by robust domestic demand across our key segments. This progress is a testament to the dedication and expertise of our teams, who continue to drive operational excellence and uphold the highest standards of product quality. Their efforts have enabled us to successfully navigate an evolving and challenging market environment. Our export markets continue to pose challenges amidst global economic headwinds and ongoing geopolitical uncertainties. Despite these conditions, we remain confident in the competitive strength of our product portfolio and the durability of our long-term partnerships. We are further strengthening our foundation by prioritizing investments in innovation, capacity expansion, and customer engagement, ensuring we are well positioned for sustained growth in both India and International markets. We are closely monitoring the recent U.S. tariff decision. While the full impact is yet to unfold, I am confident in our ability to adapt and advance our presence in the U.S. market, reinforced by enduring customer relationships and our consistent commitment to quality.”

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German tier 1 supplier ZF has begun the production of its Electric Park Brake (EPB) system in India, which is being integrated by a leading Indian automaker in its recently launched electric passenger vehicle.

The company shared that the EPB system will support India’s growing shift towards electrification, safety and next-generation vehicle technologies. It also aligns with ZF’s strategy of ‘Make in India for India and the World’.

ZF’s EPB enables low drag and noise, vibration and harshness (NVH), along with improving fuel economy. Furthermore, integration of EPB represents a significant step in the electrification of mechanical systems, and when working in tandem with other vehicle systems, it enables advanced functions.

The EPB also enhances driver safety by allowing two-wheel anti-lock emergency stops and providing convenient activation with a simple touch of a button. Featuring dynamic actuation and brake pad wear sensing, it minimises degradation associated with traditional mechanical systems.

Its modular architecture enables scalability across vehicle segments, from passenger cars to light commercial vehicles and light trucks - offering Indian OEMs both performance and flexibility in vehicle design.

Akash Passey, President, ZF Group in India, said, “The SOP of ZF’s first Electric Park Brake in India, on a product like the all-new EV car platform, embodies ZF’s commitment to offer leading mobility solutions for local requirements. With advanced systems like the EPB, we are not only enhancing vehicle safety and performance but also supporting Indian auto makers in providing world class and safe products in India.”

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Bengaluru-headquartered engineering R&D company L&T Technology Services has been inducted in John Deere's Supplier Hall of Fame for achieving Partner-level Supplier Status for five consecutive years in the John Deere Achieving Excellence (AE) Program.

The company has consistently met John Deere’s benchmarks for quality, delivery and innovation, earning the Partner-level status for FY2020 through FY2024. In FY2021, the company was also named Supplier of the Year. The recognition highlights LTTS’ ongoing contribution across engineering and digital services for John Deere operations in North America and India. These services include digital solutions, product simulation, embedded software, mechanical design, cost management, advanced analysis and customer support.

Alind Saxena, Executive Director & President, Mobility & Tech, L&T Technology Services, said, “The induction into the John Deere Supplier Hall of Fame is a testament to our pursuit of excellence and innovation in the Mobility segment. Achieving Partner-level Supplier Status for five consecutive years reflects the depth of our engineering expertise and the trust John Deere places in LTTS. We remain dedicated to delivering cutting-edge solutions that not only meet but consistently exceed the expectations of our partners worldwide.”

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The Association of Indian Forging Industry (AIFI) has entered a strategic partnership with the Bureau of Energy Efficiency (BEE) under the Ministry of Power through a landmark MoU. Signed in the presence of Union Minister Manohar Lal, this collaboration aims to accelerate sustainable manufacturing practices in the forging industry under the Assistance for Deployment of Energy Efficient Technologies in Industrial Establishments (ADEETIE) scheme.

The ADEETIE initiative supports MSMEs in 14 energy-intensive sectors by facilitating access to cutting-edge energy-efficient technologies. With an INR 10 billion budgetary allocation, the scheme will catalyse over INR 90 billion in investments, including INR 67.50 billion in MSME financing. Eligible forging units can avail interest subventions of five percent (micro/small enterprises) and three percent (medium enterprises), along with technical assistance in energy audits and project implementation.

As a backbone of India’s automotive, defence and capital goods sectors, the forging industry faces significant energy challenges. This MoU positions AIFI as a bridge between MSMEs and government resources, enabling adoption of eco-friendly technologies. The alliance reinforces India’s commitment to sustainable industrial growth, helping manufacturers lower operational costs while aligning with national decarbonisation goals.

Yash Munot, President, AIFI, said, “This collaboration with the Bureau of Energy Efficiency marks a significant step forward for the Indian forging industry. As one of the most energy-intensive sectors, forging stands to benefit immensely from the structured support offered under the ADEETIE scheme. By enabling access to financial incentives and technical guidance, this initiative will empower MSMEs to adopt cutting-edge, energy-efficient technologies. It aligns perfectly with our vision of building a globally competitive, environmentally responsible and innovation-driven forging ecosystem. AIFI is committed to mobilising our members across clusters to take full advantage of this opportunity and contribute meaningfully to India’s broader sustainability and industrial growth goals."

Deven Doshi, Chairman – Government Interface, AIFI, said, “Energy efficiency is very essential for forging companies, but the MSME sector often faces structural barriers in adopting cleaner and more efficient technologies. The ADEETIE scheme provides a structured framework of support, including technical, operational and financial aspects, that directly addresses these challenges. AIFI is proud to be a partner in this transformative journey. This collaboration not only ensures sectoral compliance with energy norms but also paves the way for long-term industrial modernisation.”

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