Texas Instruments unveiled four integrated automotive chips in a virtual event, designed to reimagine in-cabin experience for both drivers and passengers. The high-tech chips were also showcased at the Consumer Electronics Show 2025 held in Las Vegas. The line-up included the AWRL6844 millimetre-wave radar sensor with AI-enhanced safety features, the AM275x-Q1 MCUs and the AM62D-Q1- a family of MCUs featuring the powerful C7X DSP core for premium audio- and the innovative TAS6754-Q1 audio amplifier with proprietary 1L modulation technology.

Alluding to the matter, a company official said, “The new-age automotive chips centre around advanced driver assistance systems (ADAS) and infotainment and cluster. As consumers, we expect a lot from our vehicles and this innovation is driven by two key factors. First, new government regulations and car assessment programmes mandate improvements in passenger safety, requiring more accurate and robust in-cabin sensing systems to monitor a variety of situations. Second, there is a growing demand for premium audio experiences as in-car systems now often surpass home audio systems in quality, delivering unparalleled experiences across a wide range of vehicles.”

“Our silicon solutions are designed to empower designers to enhance the overall in-vehicle experience without compromise. To that end, we are excited to debut three new automotive products,” he added.

Radar sensor

The AWRL6844 is designed to help customers deliver a safe and feature-rich user experience. It aims to enhance the user experience visually and improve safety. The company highlighted that OEMS face challenges in meeting stringent requirements while minimising cost and design complexity. Moreover, requirements for transference detection would award points only for direct sensing systems capable of detecting the presence of a human inside a vehicle by tracking signs of life such as artery aspiration rates and movements. Future in-cabin sensing systems would need to accurately differentiate between children and adults to enhance user experience and safety.

The AWRL6844 is the industry’s first single-chip solution that supports these three key applications, which has been achieved through the integration of AI into the silicon, claimed the company.

The sensor integration was said to provide optimal spatial resolution, delivering dense point cloud data for applications in a cost-effective manner while leveraging edge AI processing. This high-resolution data feeds into AI-driven algorithms on a customisable, on-chip auto accelerator and DSP, enabling local data processing. This approach, allows automotive systems to achieve advanced sensing with a single chip solution, reducing system cost and complexity.

The AWRL6844 will help OEMs could deliver seamless detection, validation and classification, simplifying sensing topologies and modalities used today or in the future.

For instance, the system can detect localised occupants with up to 98 percent accuracy to minimise detection errors. This eliminates uncertainty related to seatbelt detection when a non-human object is on the seat. When the car is parked, the sensor uses neural networks to classify adults and children with high accuracy, trained to detect micro-movements and distinguish between them. The device also enhances detection in blind spots, preventing children from being left unattended in vehicles.

Audio processor

On the other hand, the AM275x-Q1 MCU and AM62D-Q1 processors enable leveraging advanced audio features that enhance in-cabin experience. Another company official noted, “Audio is increasingly used in cars to enhance safety with features like door chimes and seatbelt reminders as well as to improve passenger comfort across vehicle fleets. These features are no longer limited to luxury vehicles. Our solutions bring premium audio capabilities across the entire OEM vehicle line-up, leveraging a unified software investment.” 

“At the core of this innovation our C7x DSP core. It supports a higher number of speakers and multiple audio zones, delivering high-quality sound throughout the vehicle. The C7x DSP achieves 4-8 times the processing performance of competing devices, enabling the management of multiple audio features within a single core, thus reducing the need for external components,” the official added.

The C7x DSP’s performance is made possible by its 256-bit vector architecture and single-cycle memory access, alongside pipeline optimisations that drive industry-leading audio benchmarks. Additionally, the integrated neural processing unit allows customers to develop and execute AI algorithms on the same platform. This high processing capability reduces component requirements for automotive audio systems while enabling advanced features like real-time tuning, spatial audio and latency-reduced ANC. 

“This is especially critical for EVs, which often lack passive sound-dampening materials, relying instead on active solutions to maintain cabin quietness. TI’s solutions also support Acoustic Vehicle Alerting Systems (AVAS) for external pedestrian alerts, making them integral to modern EV designs,” added the official.

The AM275x-Q1 MCU is a DDR-less single-chip solution tailored for high-performance audio applications, supporting up to 32 channels. Its integrated 4.5 MB SRAM and up to 6 MB L3 memory eliminate the need for external memory, reducing system complexity. In contrast, the AM62D-Q1 processor is DDR-based and suited for applications requiring large memory sizes such as high-resolution playback or simultaneous AI and audio processing. With a high-speed DDR4 controller, it ensures real-time compute capabilities and smooth performance. 

The company claimed that both chips will enable engineers to design premium audio systems with minimal investment in hardware and software. 

The TAS6754-Q1 Class D amplifier’s modulation technology reduces the number of required inductors by half. This advancement enables more compact, lightweight and cost-efficient designs without compromising audio quality. Additionally, the amplifier incorporates real-time load diagnostics, streamlining design processes and enhancing efficiency to meet OEM demands effectively.

Commenting on the new products, Senior Vice President of TI’s Embedded Processing Amichai Ron said, “Today’s drivers expect any car – entry-level to luxury, combustion to electric – to have enhanced in-cabin experiences. TI continues to provide innovative technologies to enable the future of the automotive driving experience. Our edge AI-enabled radar sensors allow automakers to make vehicles safer and more responsive to the driver, while our audio systems-on-chip elevate the drive through more immersive audio. Together they create a whole new level of in-cabin experiences.”

The chips are available at the company’s website.

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Highway Roop Precision Technologies, a Carlyle-backed manufacturer of precision torque and control components, has completed the acquisition of Chamundi Die Cast, which manufactures complex aluminium die-cast components for automotive and industrial applications.

The transaction adds integrated aluminium die-casting and machining capabilities to Highway Roop's existing forging and precision-machining operations across steering, transmission and powertrain systems.

The acquisition expands Highway Roop’s product portfolio into lightweight vehicle solutions and electric vehicle components, while establishing a manufacturing footprint in South India alongside Chamundi's existing customer base in India, North America and Europe.

At present, Chamundi exports 60 percent of its products to global markets, while domestic business accounts for 40 percent. Interestingly, 98 percent of its business comes from the automotive industry, while the remaining comes from non-automotive sector.

Mohit Oswal, Chairman, Highway Roop, said, “This acquisition is an important milestone in our journey to build Highway Roop into a scaled, diversified precision manufacturing platform anchored in mission-critical torque and control applications. Chamundi’s capabilities and customer relationships complement our existing strengths and strengthen our ability to serve customers across automotive and industrial applications. Together, we are building a stronger platform for the next phase of growth.”

Dharmesh Arora, Group CEO and Director, Highway Roop, said, “Chamundi meaningfully strengthens Highway Roop’s capabilities around our core focus on torque and control applications. Its integrated aluminum die-casting and precision-machining capabilities expand our ability to deliver complex, lightweight engineered solutions across vehicle technologies. Its South India manufacturing base also diversifies our footprint, brings us closer to key customers, and strengthens the resilience of our manufacturing network and supply chain. We are delighted to welcome the Chamundi team to Highway Roop and look forward to building a stronger platform together.”

Yasin Khan, Managing Director, Chamundi, said, “Over four decades, Chamundi has built a strong business anchored in engineering excellence, a committed workforce and long-standing customer relationships. We are pleased to partner with Highway Roop for the next phase of our journey and will continue to hold a stake in the combined entity. Highway Roop’s complementary capabilities and scale will enable us to build on this foundation, deepen our relationships with customers, and create new opportunities for our employees, as we grow together.”

Amit Jain, Partner and Head, Carlyle India Advisors, said, “This transaction reflects Carlyle’s continued commitment to building a scaled, differentiated precision manufacturing platform in India. Highway Roop has established itself as a trusted partner to global OEMs for mission-critical torque and control components, and Chamundi adds complementary capabilities that further strengthen its customer proposition. We remain focused on supporting Highway Roop as it scales its capabilities and builds towards becoming one of India’s leading precision manufacturing companies serving automotive and industrial customers globally.”

Following the completion of the acquisition, Chamundi's leadership will retain an equity stake in the combined entity as part of the integration into Highway Roop's global supply platform.

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American component supplier Stoneridge has appointed Uwe Brandenburg as its Global Vice-President, Engineering and Innovation, effective 2 November 2026. Brandenburg will report to President and Chief Executive Officer Natalia Noblet and join the company’s executive management team.

In his new role, Brandenburg will oversee Stoneridge’s global engineering division, managing product development, technology innovation and product roadmaps across vision systems, safety technology, vehicle intelligence and connectivity platforms for commercial vehicles and off-highway equipment.

Natalia Noblet said, "Uwe is a recognised voice in automotive electronics and engineering leadership, with a proven track record of building world-class engineering teams and delivering breakthrough innovations in ADAS, autonomous driving and software-defined vehicles. His extensive experience bringing next-generation radar, camera, safety electronics and AI-powered platforms to market, combined with his strategic vision and commitment to operational excellence, make him an exceptional addition to our Executive Team. We are excited to leverage his expertise to accelerate Stoneridge’s technology roadmap and strengthen our competitive position in vehicle intelligence and safety.”

Brandenburg comes with over 25 years of experience in Tier 1 automotive electronics, software engineering and vehicle systems. Prior to joining Stoneridge, he served as Chief Technology Officer and Senior Vice-President for Automotive and Manufacturing at DXC Technology.

His previous positions include Global Head of Engineering and Chief Technology Officer for advanced driver assistance systems at Valeo, alongside engineering leadership roles at Continental, Autoliv and TRW Automotive focused on radar, camera and safety electronics systems.

Uwe Brandenburg said, “Stoneridge has a clear technology strategy, a highly talented engineering organisation, and a mission centred on improving safety, reducing emissions and increasing vehicle efficiency for our customers. When cutting-edge technology is paired with the right team and a purpose that truly matters, we have what it takes to create strong value for our customers. I look forward to building on this strong foundation and helping the team deliver the next generation of vision and safety solutions.”

Brandenburg holds a degree in Electrical and Telecommunications Engineering from the University of Applied Sciences Constance and currently serves on the board of directors of BlincVision.

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HS HYOSUNG ADVANCED MATERIALS will participate in CAMX 2026, the Composites and Advanced Materials Expo, held in Atlanta from 22 to 24 September. As North America's largest exhibition for composite and advanced materials, it expects over 500 companies and roughly 7,000 visitors. The company has exhibited every year since the event's debut in 2014, strengthening its North American presence.

At this year's show, HS HYOSUNG ADVANCED MATERIALS will display 3K carbon fibre, 3K fabrics and composites for drones and high-pressure vessels for satellites. Carbon fibre applications are expanding across automotive wheels, hoods and brake discs, sports goods such as hockey sticks, pickleball rackets and surfboards, wire cores and increasingly aerospace, defence and drones.

TANSOME, independently developed in 2011 as Korea's first proprietary carbon fibre, weighs one-quarter as much as steel while offering ten times the strength and seven times the elasticity. Commercial production began in Jeonju in 2013, followed by a China base in 2024 and planned Vietnam operations in late 2026, ensuring a stable global supply chain.

International certifications validate the company's capabilities, including IATF 16949 in 2019 and AS9100 in 2021. In 2022, it developed H3065, a T-1000-grade ultra-high-strength carbon fibre, becoming only the third company worldwide after Japan and the United States to do so.

Jin-dal Lim, CEO, HS HYOSUNG ADVANCED MATERIALS, said, “CAMX 2026 is an important platform for sharing the latest technologies and market trends with leading companies and customers in the global composite materials industry and exploring new business opportunities. We will provide differentiated carbon fibre solutions for advanced industries, including aerospace and aviation, based on our high-performance carbon fibre technologies and stable supply capabilities.”

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Imperial Auto Industries Limited has appointed James Gaylord as Managing Director & Chief Executive Officer of its subsidiary, Imperial Auto USA Corp. In his new role, Gaylord will lead Imperial Auto’s operations across the Americas and drive the company’s next phase of growth in the region. He will report to Vikram Wagh, Managing Director & CEO, Imperial Auto Industries Limited.

Gaylord's mandate would include expanding Imperial Auto’s presence into new markets across the American region while driving significant revenue growth over the coming years. He will also focus on strengthening the company’s product engineering and new product development capabilities in the Americas, while leading initiatives to localise the supply chain, enhance purchasing capabilities and build strategic partnerships with suppliers to support the company’s regional growth.

With nearly three decades of experience across the automotive and manufacturing sectors, Gaylord brings with him proven expertise in business development, operational excellence, transformation and growth. Prior to joining Imperial Auto, he served as the Global Sales Director at Gentex. He has also held leadership roles at organisations including Johnson Controls, ATI and Tenneco.
 

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