Texas Instruments unveiled four integrated automotive chips in a virtual event, designed to reimagine in-cabin experience for both drivers and passengers. The high-tech chips were also showcased at the Consumer Electronics Show 2025 held in Las Vegas. The line-up included the AWRL6844 millimetre-wave radar sensor with AI-enhanced safety features, the AM275x-Q1 MCUs and the AM62D-Q1- a family of MCUs featuring the powerful C7X DSP core for premium audio- and the innovative TAS6754-Q1 audio amplifier with proprietary 1L modulation technology.

Alluding to the matter, a company official said, “The new-age automotive chips centre around advanced driver assistance systems (ADAS) and infotainment and cluster. As consumers, we expect a lot from our vehicles and this innovation is driven by two key factors. First, new government regulations and car assessment programmes mandate improvements in passenger safety, requiring more accurate and robust in-cabin sensing systems to monitor a variety of situations. Second, there is a growing demand for premium audio experiences as in-car systems now often surpass home audio systems in quality, delivering unparalleled experiences across a wide range of vehicles.”

“Our silicon solutions are designed to empower designers to enhance the overall in-vehicle experience without compromise. To that end, we are excited to debut three new automotive products,” he added.

Radar sensor

The AWRL6844 is designed to help customers deliver a safe and feature-rich user experience. It aims to enhance the user experience visually and improve safety. The company highlighted that OEMS face challenges in meeting stringent requirements while minimising cost and design complexity. Moreover, requirements for transference detection would award points only for direct sensing systems capable of detecting the presence of a human inside a vehicle by tracking signs of life such as artery aspiration rates and movements. Future in-cabin sensing systems would need to accurately differentiate between children and adults to enhance user experience and safety.

The AWRL6844 is the industry’s first single-chip solution that supports these three key applications, which has been achieved through the integration of AI into the silicon, claimed the company.

The sensor integration was said to provide optimal spatial resolution, delivering dense point cloud data for applications in a cost-effective manner while leveraging edge AI processing. This high-resolution data feeds into AI-driven algorithms on a customisable, on-chip auto accelerator and DSP, enabling local data processing. This approach, allows automotive systems to achieve advanced sensing with a single chip solution, reducing system cost and complexity.

The AWRL6844 will help OEMs could deliver seamless detection, validation and classification, simplifying sensing topologies and modalities used today or in the future.

For instance, the system can detect localised occupants with up to 98 percent accuracy to minimise detection errors. This eliminates uncertainty related to seatbelt detection when a non-human object is on the seat. When the car is parked, the sensor uses neural networks to classify adults and children with high accuracy, trained to detect micro-movements and distinguish between them. The device also enhances detection in blind spots, preventing children from being left unattended in vehicles.

Audio processor

On the other hand, the AM275x-Q1 MCU and AM62D-Q1 processors enable leveraging advanced audio features that enhance in-cabin experience. Another company official noted, “Audio is increasingly used in cars to enhance safety with features like door chimes and seatbelt reminders as well as to improve passenger comfort across vehicle fleets. These features are no longer limited to luxury vehicles. Our solutions bring premium audio capabilities across the entire OEM vehicle line-up, leveraging a unified software investment.” 

“At the core of this innovation our C7x DSP core. It supports a higher number of speakers and multiple audio zones, delivering high-quality sound throughout the vehicle. The C7x DSP achieves 4-8 times the processing performance of competing devices, enabling the management of multiple audio features within a single core, thus reducing the need for external components,” the official added.

The C7x DSP’s performance is made possible by its 256-bit vector architecture and single-cycle memory access, alongside pipeline optimisations that drive industry-leading audio benchmarks. Additionally, the integrated neural processing unit allows customers to develop and execute AI algorithms on the same platform. This high processing capability reduces component requirements for automotive audio systems while enabling advanced features like real-time tuning, spatial audio and latency-reduced ANC. 

“This is especially critical for EVs, which often lack passive sound-dampening materials, relying instead on active solutions to maintain cabin quietness. TI’s solutions also support Acoustic Vehicle Alerting Systems (AVAS) for external pedestrian alerts, making them integral to modern EV designs,” added the official.

The AM275x-Q1 MCU is a DDR-less single-chip solution tailored for high-performance audio applications, supporting up to 32 channels. Its integrated 4.5 MB SRAM and up to 6 MB L3 memory eliminate the need for external memory, reducing system complexity. In contrast, the AM62D-Q1 processor is DDR-based and suited for applications requiring large memory sizes such as high-resolution playback or simultaneous AI and audio processing. With a high-speed DDR4 controller, it ensures real-time compute capabilities and smooth performance. 

The company claimed that both chips will enable engineers to design premium audio systems with minimal investment in hardware and software. 

The TAS6754-Q1 Class D amplifier’s modulation technology reduces the number of required inductors by half. This advancement enables more compact, lightweight and cost-efficient designs without compromising audio quality. Additionally, the amplifier incorporates real-time load diagnostics, streamlining design processes and enhancing efficiency to meet OEM demands effectively.

Commenting on the new products, Senior Vice President of TI’s Embedded Processing Amichai Ron said, “Today’s drivers expect any car – entry-level to luxury, combustion to electric – to have enhanced in-cabin experiences. TI continues to provide innovative technologies to enable the future of the automotive driving experience. Our edge AI-enabled radar sensors allow automakers to make vehicles safer and more responsive to the driver, while our audio systems-on-chip elevate the drive through more immersive audio. Together they create a whole new level of in-cabin experiences.”

The chips are available at the company’s website.

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KRAIBURG TPE has introduced an innovative material solution built upon its well-established THERMOLAST K product line, specifically engineered for automotive sealing applications. This new variant combines proven performance traits with enhanced ecological benefits, incorporating a recycling content that exceeds 50 percent derived from both post-industrial and post-consumer sources. Despite this high proportion of recycled material, the compound does not compromise on the stringent quality, functional reliability and processability standards demanded by the automotive sector.

In close collaboration with long-term partner SaarGummi, an international automotive supplier, KRAIBURG TPE set out to create a more sustainable alternative that could seamlessly replace conventional materials in existing applications. The partnership began development work in 2023, focusing on increasing recycled raw material usage while preserving the high mechanical load capacity, resistance to various environmental factors and dependable industrial processing characteristics required for automotive components. Early-stage testing under comparable conditions confirmed that the new recycling-based variant met all relevant requirements and could be reliably integrated into standard production workflows.

The joint effort has yielded a thermoplastic elastomer solution featuring a recycling content of approximately 56 percent, composed entirely of post-industrial and post-consumer recyclates. This outcome enables a material option with significantly reduced resource consumption for demanding automotive uses, answering the growing need for sustainability across the entire value chain without sacrificing quality or manufacturing efficiency.

Alexander Mayer, Senior Business Development Manager, KRAIBURG TPE, said, “The first results have shown that we are on the right track with this development. Our aim was to design a materials solution that saves more resources while meeting the high quality standards of the automotive industry.”

Sebastien Roux, TPE Material & Process Specialist, SaarGummi, said, “The new material meets the requirements of our application and can be reliably combined with existing components. At the same time, the increased recycling content makes an important contribution to greater sustainability. It was possible not only to increase the recycling content but also to reduce the product carbon footprint (PCF) of the material compared to that of the previous variant.”

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European tier 1 supplier Marelli has announced it will present its latest in-cabin technologies at Auto China 2026 in Beijing, scheduled from 24 April to 3 May. The showcase focuses on the integration of electronics and interiors to support software-defined vehicles (SDVs) through unified computing and scalable architectures.

The centrepiece of the exhibition is a software-defined cockpit experience that centralises computing, artificial intelligence and human-machine interface (HMI) functions. Built on a QNX real-time operating system (RTOS), the system manages in-vehicle infotainment, cluster visualisation and cabin intelligence within a single architecture.

Key display at its booth includes –

MiniLED FALD Display: An ultra-thin Full Array Local Dimming screen designed for high contrast and sunlight readability, supporting curved pillar-to-pillar configurations.

HorizonView Display: A continuous 44.8-inch image projected across the base of the windshield. Powered by a Picture Generation Unit (PGU) capable of 12,000 nits, it provides a panoramic visual field intended to reduce driver distraction.

Marelli is also introducing a zonal electrical/electronic (E/E) architecture to centralise intelligence and reduce wiring complexity. This approach utilises an ‘edge node’ strategy to remove local microcontrollers (MCUs) from peripheral modules.

MCU-Free Modules: Door and seat modules shift window, mirror, and safety functions to the Zone Control Unit (ZCU) or central compute unit via low-latency protocols.

Zonal Audio: Multi-zone audio distribution is managed at the zonal level, utilising Ethernet-based amplifiers. This configuration eliminates the need for local digital signal processors (DSPs) in every speaker location.

Connectivity: The company will debut an Affordable 5G RedCap (Reduced Capability) telematics solution. It offers 2.5 times lower latency than 4G at a similar cost, supporting over-the-air (OTA) updates and remote diagnostics.

The cabin experience is further defined by mechanical and lighting solutions designed for personalisation and space efficiency:

Cockpit Features: Motorised swivel speakers for directional audio, motorised vents for climate management, and retractable tables for workspace versatility.

Console Design: A multi-access console lid that opens from three sides and a detachable display mechanism for rear-seat passenger access to controls and entertainment.

Joachim Fetzer, Chief Technology and Innovation Officer, Marelli, said, “In the cabin of the future, technology must feel human – intuitive, responsive and seamlessly integrated. At Auto China, we will demonstrate how Marelli unifies compute, display, audio, and interior design into a coherent, software-defined experience enabled by deep local engineering and strong partnerships.”

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Bosch, the flagship entity of the Bosch Group in India, has announced its intention to acquire 100 percent of Bosch Chassis Systems India. The transaction is structured as a cash deal combined with the issuance of equity shares on a preferential basis.

The acquisition integrates the Vehicle Motion business into Bosch’s portfolio. This move is designed to unify the company’s mobility offerings, shifting from the supply of individual components to the delivery of integrated platform solutions.

Bosch Chassis Systems India specialises in automotive safety systems. Its product range includes:

• Active Safety: Antilock braking systems (ABS), electronic stability control (ESC) and advanced braking systems.
• Passive Safety: Airbag electronic control units (ECUs) and sensors.
• Actuation Systems: Braking hardware for passenger cars, two-wheelers and commercial vehicles.

The realignment allows Bosch to expand its investment in safety and braking technologies alongside its existing operations in power solutions.

Following the acquisition, Bosch Chassis Systems India will operate as an independent entity, with its governance overseen by Bosch. The boards of the Bosch Group, Bosch and Bosch Chassis Systems India have approved the transaction. The deal remains subject to approval from Bosch shareholders, after which the unit will become a wholly-owned subsidiary.

Guruprasad Mudlapur, President, Bosch Group in India and MD, Bosch, said, “Adding Bosch Chassis Systems India, with a future-fit vehicle motion solutions business into Bosch Limited, demonstrates our organisational belief in enhancing the company’s growth trajectory through portfolio diversification. This transaction further solidifies our leadership presence within mobility, enabling us to utilise our strengths and deliver solutions backed by local research and development and local manufacturing.”

Sandeep Nelamangala, Joint Managing Director of Bosch and President of Bosch Mobility India, added, “In India, we expect the mobility landscape to evolve radically by 2030 and beyond with sustainable, safe and exciting technologies. To foster a customer- first mindset and pivot from supplying individual components to delivering future- ready platform solutions, it is imperative to unite our forces and adopt an integrated approach. This transaction empowers Bosch to drive growth with a wider portfolio and combined offerings across the mobility tech stack.”

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Sona BLW Precision Forgings (Sona Comstar) has announced the achievement of two production milestones: manufacturing 500 million differential gears and 10 million differential assemblies since its inception. The company provides mobility technology solutions for battery electric vehicles (BEVs), passenger vehicles, commercial vehicles and off-highway vehicles.

According to the company, Sona Comstar has an 8.7 percent global market share in differential gears in 2025, an increase from 4.5 percent in 2019. It operates manufacturing facilities in Gurugram, Pune and Manesar.

The company commenced production of differential gears in Gurugram in 1999. It reached 100 million units in 2013 and 400 million in 2024. the most recent 100 million units were produced within a two-year period.

For differential assemblies the production began in 2008. It crossed 5 million unit production milestone in 2023, with the subsequent 5 million units manufactured in less than three years.

The company designs and manufactures precision-forged gears and driveline components. Its growth trajectory is linked to the expansion of both conventional and electric mobility platforms. The facility in Manesar, opened in 2019, supports the production of differential assemblies specifically for the global BEV market.

Vivek Vikram Singh, Group CEO, Sona Comstar, said, “We are proud to celebrate these important milestones of our Driveline Business. They reflect the scale we have built over the years, our commitment to engineering excellence, and the trust our customers have placed in us globally. I thank our customers, suppliers, and employees for their continued support and contribution to this achievement. As mobility continues to evolve, we remain focused on innovation, expanding our integrated driveline capabilities, and delivering high-quality solutions that meet the changing needs of our customers across EV and conventional platforms.”

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