Texas Instruments unveiled four integrated automotive chips in a virtual event, designed to reimagine in-cabin experience for both drivers and passengers. The high-tech chips were also showcased at the Consumer Electronics Show 2025 held in Las Vegas. The line-up included the AWRL6844 millimetre-wave radar sensor with AI-enhanced safety features, the AM275x-Q1 MCUs and the AM62D-Q1- a family of MCUs featuring the powerful C7X DSP core for premium audio- and the innovative TAS6754-Q1 audio amplifier with proprietary 1L modulation technology.

Alluding to the matter, a company official said, “The new-age automotive chips centre around advanced driver assistance systems (ADAS) and infotainment and cluster. As consumers, we expect a lot from our vehicles and this innovation is driven by two key factors. First, new government regulations and car assessment programmes mandate improvements in passenger safety, requiring more accurate and robust in-cabin sensing systems to monitor a variety of situations. Second, there is a growing demand for premium audio experiences as in-car systems now often surpass home audio systems in quality, delivering unparalleled experiences across a wide range of vehicles.”

“Our silicon solutions are designed to empower designers to enhance the overall in-vehicle experience without compromise. To that end, we are excited to debut three new automotive products,” he added.

Radar sensor

The AWRL6844 is designed to help customers deliver a safe and feature-rich user experience. It aims to enhance the user experience visually and improve safety. The company highlighted that OEMS face challenges in meeting stringent requirements while minimising cost and design complexity. Moreover, requirements for transference detection would award points only for direct sensing systems capable of detecting the presence of a human inside a vehicle by tracking signs of life such as artery aspiration rates and movements. Future in-cabin sensing systems would need to accurately differentiate between children and adults to enhance user experience and safety.

The AWRL6844 is the industry’s first single-chip solution that supports these three key applications, which has been achieved through the integration of AI into the silicon, claimed the company.

The sensor integration was said to provide optimal spatial resolution, delivering dense point cloud data for applications in a cost-effective manner while leveraging edge AI processing. This high-resolution data feeds into AI-driven algorithms on a customisable, on-chip auto accelerator and DSP, enabling local data processing. This approach, allows automotive systems to achieve advanced sensing with a single chip solution, reducing system cost and complexity.

The AWRL6844 will help OEMs could deliver seamless detection, validation and classification, simplifying sensing topologies and modalities used today or in the future.

For instance, the system can detect localised occupants with up to 98 percent accuracy to minimise detection errors. This eliminates uncertainty related to seatbelt detection when a non-human object is on the seat. When the car is parked, the sensor uses neural networks to classify adults and children with high accuracy, trained to detect micro-movements and distinguish between them. The device also enhances detection in blind spots, preventing children from being left unattended in vehicles.

Audio processor

On the other hand, the AM275x-Q1 MCU and AM62D-Q1 processors enable leveraging advanced audio features that enhance in-cabin experience. Another company official noted, “Audio is increasingly used in cars to enhance safety with features like door chimes and seatbelt reminders as well as to improve passenger comfort across vehicle fleets. These features are no longer limited to luxury vehicles. Our solutions bring premium audio capabilities across the entire OEM vehicle line-up, leveraging a unified software investment.” 

“At the core of this innovation our C7x DSP core. It supports a higher number of speakers and multiple audio zones, delivering high-quality sound throughout the vehicle. The C7x DSP achieves 4-8 times the processing performance of competing devices, enabling the management of multiple audio features within a single core, thus reducing the need for external components,” the official added.

The C7x DSP’s performance is made possible by its 256-bit vector architecture and single-cycle memory access, alongside pipeline optimisations that drive industry-leading audio benchmarks. Additionally, the integrated neural processing unit allows customers to develop and execute AI algorithms on the same platform. This high processing capability reduces component requirements for automotive audio systems while enabling advanced features like real-time tuning, spatial audio and latency-reduced ANC. 

“This is especially critical for EVs, which often lack passive sound-dampening materials, relying instead on active solutions to maintain cabin quietness. TI’s solutions also support Acoustic Vehicle Alerting Systems (AVAS) for external pedestrian alerts, making them integral to modern EV designs,” added the official.

The AM275x-Q1 MCU is a DDR-less single-chip solution tailored for high-performance audio applications, supporting up to 32 channels. Its integrated 4.5 MB SRAM and up to 6 MB L3 memory eliminate the need for external memory, reducing system complexity. In contrast, the AM62D-Q1 processor is DDR-based and suited for applications requiring large memory sizes such as high-resolution playback or simultaneous AI and audio processing. With a high-speed DDR4 controller, it ensures real-time compute capabilities and smooth performance. 

The company claimed that both chips will enable engineers to design premium audio systems with minimal investment in hardware and software. 

The TAS6754-Q1 Class D amplifier’s modulation technology reduces the number of required inductors by half. This advancement enables more compact, lightweight and cost-efficient designs without compromising audio quality. Additionally, the amplifier incorporates real-time load diagnostics, streamlining design processes and enhancing efficiency to meet OEM demands effectively.

Commenting on the new products, Senior Vice President of TI’s Embedded Processing Amichai Ron said, “Today’s drivers expect any car – entry-level to luxury, combustion to electric – to have enhanced in-cabin experiences. TI continues to provide innovative technologies to enable the future of the automotive driving experience. Our edge AI-enabled radar sensors allow automakers to make vehicles safer and more responsive to the driver, while our audio systems-on-chip elevate the drive through more immersive audio. Together they create a whole new level of in-cabin experiences.”

The chips are available at the company’s website.

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German tier-1 supplier ZF has developed the High Revolution Drive, a 3-in-1 electric drive system capable of reaching rotational speeds of up to 30,000 rpm. Designed as a variant of the company's modular SELECT platform, the unit integrates an electric motor, power electronics and a two-stage spur gear transmission with a reduction ratio of approximately 18:1. The system delivers a peak power output of 200 kW and peak wheel torque of 3,500 Nm.

Compared to a conventional SELECT drive operating at 18,000 rpm, the High Revolution Drive reduces overall installation space and weight by nearly 25 percent, while reducing required magnet mass by 50 percent. The architecture is scalable across power outputs ranging from 150 kW to 200 kW for 400-volt and 800-volt vehicle platforms, achieving a system efficiency of nearly 93 per cent. ZF is engaging with vehicle manufacturers regarding deployment, with volume production targeted for 2030.

Thomas Meiser, Head of the E-Mobility Business Unit, ZF, said, "The High Revolution Drive draws on ZF s full systems expertise. Rather than optimising individual components in isolation, we systematically coordinate the electric motor, power electronics and transmission. Robustness and low noise and vibration levels were stringent development targets from the outset. To achieve this, we considered the electric motor, gearing, bearings and tooth geometry as an integrated system. For the configuration presented, 30,000 rpm is the economic and technical sweet spot. With SELECT, we do not have to start from scratch for every new drive variant. We use our modular system to tailor new concepts to different customer requirements."

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Tenneco Clean Air India has reported its financial results for the Q2 FY2027 and H1 FY2027, recording a 32.2 percent YoY increase in value-added revenue to INR 152.29 billion for Q2 FY2027. Revenue from operations rose 34.2 percent to INR 171.83 billion during the quarter.

Quarterly earnings before interest, tax, depreciation, and amortisation (EBITDA) grew 20.7 percent to INR 26.16 million, delivering an EBITDA margin of 17.2 percent on value-added revenue. Profit after tax increased 15 percent YoY to INR 17.34 billion.

For the first half of FY27, value-added revenue reached INR 290.44 billion, up 25.3 percent, while total revenue from operations reached INR 326.31 billion. The company announced plans to establish a new Clean Air manufacturing facility in western India with a capital expenditure of approximately INR 450 million to support its total order book, which stands at around INR 1,650 billion.

Arvind Chandra, Whole-Time Director and CEO, Tenneco India, said, "Our strong momentum continued through Q2 and H1 FY’27, driven by overall market growth, market share gains and disciplined execution across the business. During the period, we continued to deepen customer relationships and expand our technology footprint. In ART, we secured multiple platform wins across domestic and international OEMs, entered a new passenger vehicle whitespace, expanded engagement with leading OEMs, and advanced our portfolio through successful commercialization and localization initiatives. In CA and PT, we strengthened our order pipeline through key wins across commercial vehicle, CNG, and spark plug applications."

"Our growing competitive strength is reflected in continued order book providing revenue visibility exceeding 100% of our FY’30 target revenues, underpinning a healthy double-digit CAGR trajectory. To support future growth, we continue to invest in capacity expansion, localization, and innovation, including a new West India Clean Air manufacturing facility. Supported by a robust order book, increasing domestic and export penetration, technology-led customer wins, and strategic investments, we remain well positioned to sustain above-market growth and drive superior shareholder returns over the long term," added Chandra.

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SMK Helmets is marking its international expansion at EICMA 2026, supported by distribution operations across more than 70 countries alongside dedicated regional headquarters in Europe and the United States.

The company highlighted its European division, SMK Europe, established in Reggio Emilia, Italy, in May 2026 under the leadership of Chief Executive Officer Matteo Schieppati, alongside its North American arm, Bikerz US, based in Fort Wayne, Indiana.

At the event, SMK unveiled two racing helmets, the Stratos and the Allterra Carbon, alongside Konnect, its first in-house Bluetooth communication system and Cygnus, its first flip-back helmet model.

Matteo Schieppati, CEO, SMK Helmets Europe, said, "The establishment of SMK HELMETS EUROPE is a significant move to strengthen our global presence. This strategic expansion is designed to provide dedicated commercial and logistical support to dealers and distributors across Europe, while establishing a permanent footprint in the region to optimise product and communication strategies. The new European division will serve as a hub for accelerating regional growth, ensuring streamlined supply chain operations, and delivering enhanced customer service to the company's growing network of partners. Europe is a highly demanding market with a deep appreciation for premium quality and uncompromised safety standards. This footprint allows us to align our product innovation and marketing strategies directly with the expectations of European consumers. With this expansion, SMK reinforces its commitment to global excellence, bringing its innovative helmet technology and manufacturing expertise closer to one of the world's most dynamic motorcycling communities."

Shilpa Arora, Global Head of Sales, SMK Helmets, said, "SMK is gaining market share in every market in which it operates, and riders are starting to link our name with safety, excellence and distinctive design. That doesn't happen alone. Our distributors, dealers, riders and teams are one SMK family, and with our own presence in Europe and the US, we are closer to that family than ever. What we're showing at EICMA is just the beginning."

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BorgWarner has secured multiple business awards for eMotor in China covering range-extended vehicle, battery-electric vehicle and hybrid vehicle platforms. Production for the awarded programs is scheduled to begin between 2027 and 2028.

The projects include an agreement with a joint venture of a global original equipment manufacturer to supply high-voltage hairpin P1 eMotor stator and rotor assemblies delivering 115kW peak power for a range-extended vehicle platform. The company will also provide high-voltage hairpin main drive eMotor stator and rotor assemblies for a Chinese electric vehicle manufacturer's SUV platforms operating on a 715V architecture, delivering 300kW peak power and 495Nm peak torque. Additionally, BorgWarner will supply stator and rotor assemblies utilising its S-winding technology for a 130kW P2 eMotor integrated into hybrid propulsion systems for global markets.

Isabelle McKenzie, Vice-President of BorgWarner Inc and President and General Manager of PowerDrive Systems, said, "We are pleased to establish and expand our eMotor business with customers across China. The breadth of these programs demonstrates our ability to address diverse application requirements through strong product performance, cost optimisation and localised manufacturing. With our established engineering and production footprint in China, we are well positioned to support customers as they develop their next generation of electrified vehicles."

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