Texas Instruments unveiled four integrated automotive chips in a virtual event, designed to reimagine in-cabin experience for both drivers and passengers. The high-tech chips were also showcased at the Consumer Electronics Show 2025 held in Las Vegas. The line-up included the AWRL6844 millimetre-wave radar sensor with AI-enhanced safety features, the AM275x-Q1 MCUs and the AM62D-Q1- a family of MCUs featuring the powerful C7X DSP core for premium audio- and the innovative TAS6754-Q1 audio amplifier with proprietary 1L modulation technology.

Alluding to the matter, a company official said, “The new-age automotive chips centre around advanced driver assistance systems (ADAS) and infotainment and cluster. As consumers, we expect a lot from our vehicles and this innovation is driven by two key factors. First, new government regulations and car assessment programmes mandate improvements in passenger safety, requiring more accurate and robust in-cabin sensing systems to monitor a variety of situations. Second, there is a growing demand for premium audio experiences as in-car systems now often surpass home audio systems in quality, delivering unparalleled experiences across a wide range of vehicles.”

“Our silicon solutions are designed to empower designers to enhance the overall in-vehicle experience without compromise. To that end, we are excited to debut three new automotive products,” he added.

Radar sensor

The AWRL6844 is designed to help customers deliver a safe and feature-rich user experience. It aims to enhance the user experience visually and improve safety. The company highlighted that OEMS face challenges in meeting stringent requirements while minimising cost and design complexity. Moreover, requirements for transference detection would award points only for direct sensing systems capable of detecting the presence of a human inside a vehicle by tracking signs of life such as artery aspiration rates and movements. Future in-cabin sensing systems would need to accurately differentiate between children and adults to enhance user experience and safety.

The AWRL6844 is the industry’s first single-chip solution that supports these three key applications, which has been achieved through the integration of AI into the silicon, claimed the company.

The sensor integration was said to provide optimal spatial resolution, delivering dense point cloud data for applications in a cost-effective manner while leveraging edge AI processing. This high-resolution data feeds into AI-driven algorithms on a customisable, on-chip auto accelerator and DSP, enabling local data processing. This approach, allows automotive systems to achieve advanced sensing with a single chip solution, reducing system cost and complexity.

The AWRL6844 will help OEMs could deliver seamless detection, validation and classification, simplifying sensing topologies and modalities used today or in the future.

For instance, the system can detect localised occupants with up to 98 percent accuracy to minimise detection errors. This eliminates uncertainty related to seatbelt detection when a non-human object is on the seat. When the car is parked, the sensor uses neural networks to classify adults and children with high accuracy, trained to detect micro-movements and distinguish between them. The device also enhances detection in blind spots, preventing children from being left unattended in vehicles.

Audio processor

On the other hand, the AM275x-Q1 MCU and AM62D-Q1 processors enable leveraging advanced audio features that enhance in-cabin experience. Another company official noted, “Audio is increasingly used in cars to enhance safety with features like door chimes and seatbelt reminders as well as to improve passenger comfort across vehicle fleets. These features are no longer limited to luxury vehicles. Our solutions bring premium audio capabilities across the entire OEM vehicle line-up, leveraging a unified software investment.” 

“At the core of this innovation our C7x DSP core. It supports a higher number of speakers and multiple audio zones, delivering high-quality sound throughout the vehicle. The C7x DSP achieves 4-8 times the processing performance of competing devices, enabling the management of multiple audio features within a single core, thus reducing the need for external components,” the official added.

The C7x DSP’s performance is made possible by its 256-bit vector architecture and single-cycle memory access, alongside pipeline optimisations that drive industry-leading audio benchmarks. Additionally, the integrated neural processing unit allows customers to develop and execute AI algorithms on the same platform. This high processing capability reduces component requirements for automotive audio systems while enabling advanced features like real-time tuning, spatial audio and latency-reduced ANC. 

“This is especially critical for EVs, which often lack passive sound-dampening materials, relying instead on active solutions to maintain cabin quietness. TI’s solutions also support Acoustic Vehicle Alerting Systems (AVAS) for external pedestrian alerts, making them integral to modern EV designs,” added the official.

The AM275x-Q1 MCU is a DDR-less single-chip solution tailored for high-performance audio applications, supporting up to 32 channels. Its integrated 4.5 MB SRAM and up to 6 MB L3 memory eliminate the need for external memory, reducing system complexity. In contrast, the AM62D-Q1 processor is DDR-based and suited for applications requiring large memory sizes such as high-resolution playback or simultaneous AI and audio processing. With a high-speed DDR4 controller, it ensures real-time compute capabilities and smooth performance. 

The company claimed that both chips will enable engineers to design premium audio systems with minimal investment in hardware and software. 

The TAS6754-Q1 Class D amplifier’s modulation technology reduces the number of required inductors by half. This advancement enables more compact, lightweight and cost-efficient designs without compromising audio quality. Additionally, the amplifier incorporates real-time load diagnostics, streamlining design processes and enhancing efficiency to meet OEM demands effectively.

Commenting on the new products, Senior Vice President of TI’s Embedded Processing Amichai Ron said, “Today’s drivers expect any car – entry-level to luxury, combustion to electric – to have enhanced in-cabin experiences. TI continues to provide innovative technologies to enable the future of the automotive driving experience. Our edge AI-enabled radar sensors allow automakers to make vehicles safer and more responsive to the driver, while our audio systems-on-chip elevate the drive through more immersive audio. Together they create a whole new level of in-cabin experiences.”

The chips are available at the company’s website.

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Setco Automotive Limited, a leading Indian manufacturer of heavy commercial vehicle (MHCV) clutches and premium truck components, has successfully launched its new automotive water pump. This strategic expansion into the engine cooling segment demonstrates Setco's continued commitment to delivering reliable, high-performance automotive solutions through cutting-edge engineering.

Engineered to meet the rigorous demands of light commercial vehicles (LCVs) and MHCVs, the new water pump combines advanced materials with precision manufacturing to ensure superior thermal management and consistent coolant circulation across diverse operating conditions. The product boasts several key technological advancements, including superior long-life seal integrity that enhances durability, along with exceptional load-bearing capacity to withstand extreme operational stress. Additionally, it features optimised NVH (Noise, Vibration & Harshness) isolation for smoother performance and a thermally enhanced impeller material grade that improves heat resistance and efficiency. By entering the critical engine cooling segment, Setco continues to expand its offerings while maintaining its legacy of quality, reliability and engineering excellence.

Harish Sheth, Chairman & MD, Setco Automotive Ltd, said, “This launch is a significant step in our journey to diversify and deepen our presence across the auto component value chain. Our new Automotive Water Pump reflects the same quality, performance and engineering excellence that has made Setco the benchmark in the clutch segment. With this product, we aim to deliver superior engine protection and performance while strengthening our relationships with OEMs and aftermarket customers alike.”

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American technology company Visteon has launched in-house manufacturing of its next-generation high-resolution Analog and Digital Camera System and Display Backlight Unit (BLU) at its Chennai facility in India. The company said it has initially invested USD 10 million towards developing the manufacturing capabilities.

The new production lines will build analog and digital cameras with 1.3 MP-8MP HD resolution, which it claims offers significantly sharper visuals than traditional automotive cameras. It will support the demanding requirement from modern high-definition in-car displays and are optimised for seamless integration with Advanced Driver Assistance Systems (ADAS), helping drivers park, manoeuvre and navigate with greater safety and precision. 

Sachin Lawande, President and CEO, Visteon, said, “India plays a critical role in our vertical integration strategy. Localising production of camera systems and backlight units strengthens our ability to scale, innovate, and deliver next-generation cockpit technologies more efficiently to global markets.”

Visteon stated that this expansion compliments its existing display manufacturing in India, creating a more cohesive, vertically integrated production ecosystem for next-generation cockpit solutions.

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Pune-headquartered tier 1 supplier Varroc Engineering has announced its financial results for FY2025, with revenue of INR 81 billion, up 8 percent YoY.

The company reported profit after tax of INR 1.69 billion, which was down 46 percent YoY, as compared to INR 3.15 billion for same period last year. This the company attributed due to an exceptional item worth INR 1.47 billion on the back of restructuring of subsidiaries and exit from its joint venture in China.

For Q4 FY2025, the company reported revenue of INR 20.99 billion, up 11 percent YoY, profit after tax of INR 1.03 billion.

Tarang Jain, CMD, Varroc, said, "India has now become the 4th largest economy, and the GDP had a steady growth of 6.2 percent in Q3 FY2025. Softening of Inflation in the last few quarters and interest rates reduction globally encouraged our Central Bank to reduce Repo rate by 50 basis points. Weak growth in consumption, on top of global and regional conflicts and uncertain tariff regime, may impact discretionary spending which can have impact on automotive Industry. However, we remain confident about the medium-to-the-long-term growth prospects of automotive industry.”

He revealed that in FY2025, the company filed 25 patents of which more than 10 patents were already granted to Varroc, bringing the total filings to more than 120 for the company.

“We continue to strengthen our balance sheet and return ratios. The net debt of the company in FY2025 was reduced by INR 2,348 million and as a result the net debt to equity was reduced to below 0.5x at the end FY2025 from 0.64X at the end of FY2024. The absolute net debt figure was INR 7,480 million. ROCE (before tax) for FY2025 was 20.8 percent and free cash flow generation was also healthy at INR 3,116 million or 3.8 percent of revenue before growth CAPEX in land,” he added.

IN FY2025, the company also won new business wins estimated to add INR 11,734 million in revenue, with electric vehicle constituting more than 55 percent of it.

“It is more heartening to see business wins in our overseas operations also, which will improve profitability from FY 27 onwards. Our continuing focus on revenue growth, improvement in gross margin, control on fixed cost and optimization of capex and working capital will enable us to generate healthy free cash flows in the future also,” concluded Jain.

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Samvardhana Motherson International (SAMIL) has announced its financial results for FY2025, demonstrating significant growth across key metrics.

The company reported consolidated revenue of INR 1,136 billion, up 15 percent YoY. Earnings Before Interest, Tax, Depreciation, and Amortisation (EBITDA) rose by 17 percent to INR 108.77 billion, while Profit After Tax (PAT) saw a substantial 40 percent jump, reaching INR 38.03 billion.

Vivek Chaand Sehgal, Chairman, Motherson, said, "Our performance underscores the resilience and adaptability of our business. With a booked business value exceeding USD 88 billion, encompassing both automotive and non-automotive sectors, we have established a robust foundation for future growth."

He further congratulated the Motherson team for an ‘exceptional performance’ over the past five years, achieving record sales and integrating 23 acquisitions despite global volatility, all while maintaining a strong focus on free cash flow and reducing the leverage ratio to its lowest point in five years.

The company also highlighted its strategic advancements, including outpacing the industry by approximately 15 percent through content growth and mergers and acquisitions. Return on Capital Employed (ROCE) improved to 17.2 percent at a consolidated level, even amidst expansions. Net Debt to EBITDA stands at a comfortable 0.9x. Capital expenditure for the year was INR 44.33 billion, calibrated to market dynamics.

Furthermore, 14 greenfield projects are underway, with nine expected to commence operations in FY2026.

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