Enhancing In-Cabin Experience With Smarter Chips
- By Gaurav Nandi
- January 20, 2025
Texas Instruments unveiled four integrated automotive chips in a virtual event, designed to reimagine in-cabin experience for both drivers and passengers. The high-tech chips were also showcased at the Consumer Electronics Show 2025 held in Las Vegas. The line-up included the AWRL6844 millimetre-wave radar sensor with AI-enhanced safety features, the AM275x-Q1 MCUs and the AM62D-Q1- a family of MCUs featuring the powerful C7X DSP core for premium audio- and the innovative TAS6754-Q1 audio amplifier with proprietary 1L modulation technology.
Alluding to the matter, a company official said, “The new-age automotive chips centre around advanced driver assistance systems (ADAS) and infotainment and cluster. As consumers, we expect a lot from our vehicles and this innovation is driven by two key factors. First, new government regulations and car assessment programmes mandate improvements in passenger safety, requiring more accurate and robust in-cabin sensing systems to monitor a variety of situations. Second, there is a growing demand for premium audio experiences as in-car systems now often surpass home audio systems in quality, delivering unparalleled experiences across a wide range of vehicles.”
“Our silicon solutions are designed to empower designers to enhance the overall in-vehicle experience without compromise. To that end, we are excited to debut three new automotive products,” he added.
Radar sensor
The AWRL6844 is designed to help customers deliver a safe and feature-rich user experience. It aims to enhance the user experience visually and improve safety. The company highlighted that OEMS face challenges in meeting stringent requirements while minimising cost and design complexity. Moreover, requirements for transference detection would award points only for direct sensing systems capable of detecting the presence of a human inside a vehicle by tracking signs of life such as artery aspiration rates and movements. Future in-cabin sensing systems would need to accurately differentiate between children and adults to enhance user experience and safety.
The AWRL6844 is the industry’s first single-chip solution that supports these three key applications, which has been achieved through the integration of AI into the silicon, claimed the company.
The sensor integration was said to provide optimal spatial resolution, delivering dense point cloud data for applications in a cost-effective manner while leveraging edge AI processing. This high-resolution data feeds into AI-driven algorithms on a customisable, on-chip auto accelerator and DSP, enabling local data processing. This approach, allows automotive systems to achieve advanced sensing with a single chip solution, reducing system cost and complexity.
The AWRL6844 will help OEMs could deliver seamless detection, validation and classification, simplifying sensing topologies and modalities used today or in the future.
For instance, the system can detect localised occupants with up to 98 percent accuracy to minimise detection errors. This eliminates uncertainty related to seatbelt detection when a non-human object is on the seat. When the car is parked, the sensor uses neural networks to classify adults and children with high accuracy, trained to detect micro-movements and distinguish between them. The device also enhances detection in blind spots, preventing children from being left unattended in vehicles.
Audio processor
On the other hand, the AM275x-Q1 MCU and AM62D-Q1 processors enable leveraging advanced audio features that enhance in-cabin experience. Another company official noted, “Audio is increasingly used in cars to enhance safety with features like door chimes and seatbelt reminders as well as to improve passenger comfort across vehicle fleets. These features are no longer limited to luxury vehicles. Our solutions bring premium audio capabilities across the entire OEM vehicle line-up, leveraging a unified software investment.”
“At the core of this innovation our C7x DSP core. It supports a higher number of speakers and multiple audio zones, delivering high-quality sound throughout the vehicle. The C7x DSP achieves 4-8 times the processing performance of competing devices, enabling the management of multiple audio features within a single core, thus reducing the need for external components,” the official added.
The C7x DSP’s performance is made possible by its 256-bit vector architecture and single-cycle memory access, alongside pipeline optimisations that drive industry-leading audio benchmarks. Additionally, the integrated neural processing unit allows customers to develop and execute AI algorithms on the same platform. This high processing capability reduces component requirements for automotive audio systems while enabling advanced features like real-time tuning, spatial audio and latency-reduced ANC.
“This is especially critical for EVs, which often lack passive sound-dampening materials, relying instead on active solutions to maintain cabin quietness. TI’s solutions also support Acoustic Vehicle Alerting Systems (AVAS) for external pedestrian alerts, making them integral to modern EV designs,” added the official.
The AM275x-Q1 MCU is a DDR-less single-chip solution tailored for high-performance audio applications, supporting up to 32 channels. Its integrated 4.5 MB SRAM and up to 6 MB L3 memory eliminate the need for external memory, reducing system complexity. In contrast, the AM62D-Q1 processor is DDR-based and suited for applications requiring large memory sizes such as high-resolution playback or simultaneous AI and audio processing. With a high-speed DDR4 controller, it ensures real-time compute capabilities and smooth performance.
The company claimed that both chips will enable engineers to design premium audio systems with minimal investment in hardware and software.
The TAS6754-Q1 Class D amplifier’s modulation technology reduces the number of required inductors by half. This advancement enables more compact, lightweight and cost-efficient designs without compromising audio quality. Additionally, the amplifier incorporates real-time load diagnostics, streamlining design processes and enhancing efficiency to meet OEM demands effectively.
Commenting on the new products, Senior Vice President of TI’s Embedded Processing Amichai Ron said, “Today’s drivers expect any car – entry-level to luxury, combustion to electric – to have enhanced in-cabin experiences. TI continues to provide innovative technologies to enable the future of the automotive driving experience. Our edge AI-enabled radar sensors allow automakers to make vehicles safer and more responsive to the driver, while our audio systems-on-chip elevate the drive through more immersive audio. Together they create a whole new level of in-cabin experiences.”
The chips are available at the company’s website.
Bolt.Earth And Statiq Partner To Enable Interoperable EV Charging
- By MT Bureau
- January 08, 2026
Bolt.Earth and Statiq have announced a strategic partnership to enhance electric vehicle (EV) charging access across India. The collaboration focuses on interoperability, allowing four-wheeler users to access more charging options through a unified system.
Under the agreement, EV drivers can locate, access, and pay for chargers on both the Bolt.Earth and Statiq networks using either company's mobile application.
The partnership integrates Statiq’s DC fast-charging infrastructure for four-wheelers with Bolt.Earth’s platform. This expansion targets key cities and highways to assist with intercity travel and range anxiety.
Statiq operates a network that includes both AC and DC fast-charging solutions in urban centres and commercial hubs. Bolt.Earth provides a peer-to-peer (P2P) charging platform serving two-wheeler, three-wheeler, and four-wheeler vehicles across more than 1,900 cities.
Akshit Bansal, Founder & CEO, Statiq, said, “At Statiq, our vision has always been to make public charging simple, reliable and widely accessible. Partnering with Bolt.Earth enables us to connect two strong networks and providing EV drivers with more fast-charging options through a seamless experience. By reducing the need for multiple apps and bringing more chargers onto a unified journey, we’re taking a meaningful step towards an open, interoperable charging ecosystem that supports faster EV adoption across India.”
S Raghav Bharadwaj, CEO & Founder, Bolt.Earth, said, “Interoperability is the future of EV charging in India, and this partnership is a decisive step toward that future. By uniting Bolt.Earth’s universal network with Statiq’s robust, fast-charging infrastructure, we’re delivering unmatched accessibility and convenience to EV users. This integration aims to ease range anxiety, eliminate the hassle of multiple apps, and provide a single, real-time view of available charging points—making EV charging seamless, reliable, and user-friendly.”
Toyoda Gosei Commercialises Automotive Parts With Increased Recycled Rubber
- By MT Bureau
- December 26, 2025
Japanese automotive component supplier Toyoda Gosei Co, has launched automotive weatherstrips containing a higher percentage of recycled rubber. The components have been adopted for the Toyota Motor RAV4, with plans to expand the application of this technology to other models.
While recycling processes for steel and plastic are established, rubber has historically been incinerated for energy recovery due to the complexities of devulcanisation. This process uses heat and pressure to break the sulphur bonds that provide rubber with elasticity; however, it often weakens the material and creates odours.
Toyoda Gosei has modified its proprietary devulcanisation technology to improve the quality of regenerated rubber. These refinements have allowed the company to increase the recycled content in automotive parts from under 5 percent to 20 percent. The achievement received a Project Award from Toyota Motor.
The company is now working to apply these techniques to:
- Synthetic Rubber: Expanding use in products such as rubber hoses.
- Natural Rubber: Developing processes for materials used in higher volumes across the industry.
The company intends to collaborate with vehicle manufacturers to establish a system for collecting and regenerating rubber from end-of-life vehicles. This circular model aims to reduce carbon emissions and improve resource circulation within the automotive supply chain.
Toyoda Gosei stated that by leading rubber recycling efforts, it seeks to address long-standing industry challenges regarding waste management and material strength in recycled elastomers.
- Greenfuel Energy Solutions
- Lumax Auto Technologies
- LATL
- Maruti Suzuki India
- CNG
- WEH Gas Tech
- Deepak Jain
- Anmol Jain
- Akshay Kashyap
Greenfuel Energy Solutions Starts Ferrule-less Tube Production In Manesar
- By MT Bureau
- December 22, 2025
Greenfuel Energy Solutions, a subsidiary of Lumax Auto Technologies (LATL), has opened a manufacturing line for ferrule-less tubes and fittings at its Manesar facility. The line was inaugurated by the leadership team of Maruti Suzuki India.
The project involves an initial investment of INR 250 million, with a further INR 500 million planned over the next five years. The facility has the capacity to supply components for approximately 100,000 vehicles, with production ramping up in phases.
The facility localises the production of ferrule-less tubes and fittings for CNG vehicles, a technology that was previously imported. The solution uses torque-tightened assembly for mass production. Greenfuel developed the line in collaboration with its German partner, WEH Gas Tech, adapting the technology for Indian conditions.
Deepak Jain, Director, Lumax Auto Technologies, said, “The localisation of this technology reflects our strong commitment to the ‘Make in India’ agenda. By bringing critical manufacturing capabilities onshore, we are accelerating technology transfer, strengthening domestic supply chains, and enhancing India’s competitiveness in advanced automotive manufacturing.”
Anmol Jain, Managing Director, Lumax Auto Technologies, added, “This initiative lays the foundation for scalable and sustainable growth. It improves operational efficiencies, deepens collaboration with OEM partners, and enables faster validation cycles supporting the evolution of Indian manufacturing towards higher value-added capabilities.”
The transition to domestic manufacturing is intended to reduce reliance on global supply chains and eliminate costs associated with import duties and foreign-exchange exposure.
Akshay Kashyap, MD & CEO, Greenfuel Energy Solutions, said, “We are the first and only company in India to localise ferrule-less tubes and fittings along with the underlying manufacturing technology. This Make-in-India solution offers ease of installation, reduced labour costs, and enhanced safety for the automotive industry. We have already commenced supplies to a leading OEM and are witnessing strong interest from others.”
“This technology has been proven in Europe and used by an established German automotive brand for over seven years. We have successfully indigenised it in India in collaboration with our long-standing German partner, WEH Gas Tech, a relationship spanning nearly two decades. While the core line was sourced from Germany, it has been adapted and optimised for Indian operating conditions, combining global credibility with local engineering expertise,” added Kashyap.
In 2024, Lumax Auto Technologies Limited acquired a 60 percent stake in Greenfuel Energy Solutions’ alternate fuels business for INR 1.53 billion. The division reported revenues of INR 1.7 billion in the first half of the year and maintains an order book of approximately INR 2 billion. The expansion aligns with the industry-wide shift toward alternate-fuel platforms in India.
- Uno Minda
- ICSI National Awards
- The Institute of Company Secretaries of India
- Ministry of Corporate Affairs
- Dr Raj Bhushan Choudhary
- P T Usha
- D Y Chandrachud
- Tuhin Kanta Pandey
- Securities and Exchange Board of India
- SEBI
Uno Minda Receives ICSI National Award For Corporate Governance
- By MT Bureau
- December 22, 2025
Tier 1 automotive component supplier Uno Minda has been named the ‘Best Governed Company’ at the 25th ICSI National Awards for Excellence in Corporate Governance. The company received the award in the Listed Segment (Medium Category) during a ceremony held on 19 December 2025.
The Institute of Company Secretaries of India (ICSI), a body under the Ministry of Corporate Affairs, recognised Uno Minda for its governance framework, Board structure and transparency. The evaluation also considered stakeholder value enhancement, CSR, and sustainability. The company treats governance as an enabler of growth and value creation.
The award was presented by Dr Raj Bhushan Choudhary, Minister of State for Jal Shakti, and P T Usha, Member of Parliament and President of the Indian Olympic Association.
The jury for the awards was chaired by Dr Justice D Y Chandrachud, former Chief Justice of India. Tuhin Kanta Pandey, Chairman of the Securities and Exchange Board of India (SEBI), attended the event as Guest of Honour.
This recognition follows other governance awards received by the company. Uno Minda was previously granted the ‘Amrop–ET India’s Best Board’ Award in 2021 for Board effectiveness and leadership. It also received the Golden Peacock Award for Excellence in Corporate Governance in 2020 from the Institute of Directors.
The ICSI National Awards are intended to promote governance standards that support the socio-economic objectives of the Government of India.

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