Texas Instruments unveiled four integrated automotive chips in a virtual event, designed to reimagine in-cabin experience for both drivers and passengers. The high-tech chips were also showcased at the Consumer Electronics Show 2025 held in Las Vegas. The line-up included the AWRL6844 millimetre-wave radar sensor with AI-enhanced safety features, the AM275x-Q1 MCUs and the AM62D-Q1- a family of MCUs featuring the powerful C7X DSP core for premium audio- and the innovative TAS6754-Q1 audio amplifier with proprietary 1L modulation technology.

Alluding to the matter, a company official said, “The new-age automotive chips centre around advanced driver assistance systems (ADAS) and infotainment and cluster. As consumers, we expect a lot from our vehicles and this innovation is driven by two key factors. First, new government regulations and car assessment programmes mandate improvements in passenger safety, requiring more accurate and robust in-cabin sensing systems to monitor a variety of situations. Second, there is a growing demand for premium audio experiences as in-car systems now often surpass home audio systems in quality, delivering unparalleled experiences across a wide range of vehicles.”

“Our silicon solutions are designed to empower designers to enhance the overall in-vehicle experience without compromise. To that end, we are excited to debut three new automotive products,” he added.

Radar sensor

The AWRL6844 is designed to help customers deliver a safe and feature-rich user experience. It aims to enhance the user experience visually and improve safety. The company highlighted that OEMS face challenges in meeting stringent requirements while minimising cost and design complexity. Moreover, requirements for transference detection would award points only for direct sensing systems capable of detecting the presence of a human inside a vehicle by tracking signs of life such as artery aspiration rates and movements. Future in-cabin sensing systems would need to accurately differentiate between children and adults to enhance user experience and safety.

The AWRL6844 is the industry’s first single-chip solution that supports these three key applications, which has been achieved through the integration of AI into the silicon, claimed the company.

The sensor integration was said to provide optimal spatial resolution, delivering dense point cloud data for applications in a cost-effective manner while leveraging edge AI processing. This high-resolution data feeds into AI-driven algorithms on a customisable, on-chip auto accelerator and DSP, enabling local data processing. This approach, allows automotive systems to achieve advanced sensing with a single chip solution, reducing system cost and complexity.

The AWRL6844 will help OEMs could deliver seamless detection, validation and classification, simplifying sensing topologies and modalities used today or in the future.

For instance, the system can detect localised occupants with up to 98 percent accuracy to minimise detection errors. This eliminates uncertainty related to seatbelt detection when a non-human object is on the seat. When the car is parked, the sensor uses neural networks to classify adults and children with high accuracy, trained to detect micro-movements and distinguish between them. The device also enhances detection in blind spots, preventing children from being left unattended in vehicles.

Audio processor

On the other hand, the AM275x-Q1 MCU and AM62D-Q1 processors enable leveraging advanced audio features that enhance in-cabin experience. Another company official noted, “Audio is increasingly used in cars to enhance safety with features like door chimes and seatbelt reminders as well as to improve passenger comfort across vehicle fleets. These features are no longer limited to luxury vehicles. Our solutions bring premium audio capabilities across the entire OEM vehicle line-up, leveraging a unified software investment.” 

“At the core of this innovation our C7x DSP core. It supports a higher number of speakers and multiple audio zones, delivering high-quality sound throughout the vehicle. The C7x DSP achieves 4-8 times the processing performance of competing devices, enabling the management of multiple audio features within a single core, thus reducing the need for external components,” the official added.

The C7x DSP’s performance is made possible by its 256-bit vector architecture and single-cycle memory access, alongside pipeline optimisations that drive industry-leading audio benchmarks. Additionally, the integrated neural processing unit allows customers to develop and execute AI algorithms on the same platform. This high processing capability reduces component requirements for automotive audio systems while enabling advanced features like real-time tuning, spatial audio and latency-reduced ANC. 

“This is especially critical for EVs, which often lack passive sound-dampening materials, relying instead on active solutions to maintain cabin quietness. TI’s solutions also support Acoustic Vehicle Alerting Systems (AVAS) for external pedestrian alerts, making them integral to modern EV designs,” added the official.

The AM275x-Q1 MCU is a DDR-less single-chip solution tailored for high-performance audio applications, supporting up to 32 channels. Its integrated 4.5 MB SRAM and up to 6 MB L3 memory eliminate the need for external memory, reducing system complexity. In contrast, the AM62D-Q1 processor is DDR-based and suited for applications requiring large memory sizes such as high-resolution playback or simultaneous AI and audio processing. With a high-speed DDR4 controller, it ensures real-time compute capabilities and smooth performance. 

The company claimed that both chips will enable engineers to design premium audio systems with minimal investment in hardware and software. 

The TAS6754-Q1 Class D amplifier’s modulation technology reduces the number of required inductors by half. This advancement enables more compact, lightweight and cost-efficient designs without compromising audio quality. Additionally, the amplifier incorporates real-time load diagnostics, streamlining design processes and enhancing efficiency to meet OEM demands effectively.

Commenting on the new products, Senior Vice President of TI’s Embedded Processing Amichai Ron said, “Today’s drivers expect any car – entry-level to luxury, combustion to electric – to have enhanced in-cabin experiences. TI continues to provide innovative technologies to enable the future of the automotive driving experience. Our edge AI-enabled radar sensors allow automakers to make vehicles safer and more responsive to the driver, while our audio systems-on-chip elevate the drive through more immersive audio. Together they create a whole new level of in-cabin experiences.”

The chips are available at the company’s website.

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Mumbai-headquartered JNV Group (formerly Sujan Group) has announced the strategic appointment of Sandeep Jad as the Chief Executive Officer (CEO) of its Automotive business.

Jad brings around three decades of experience in the automotive and mobility sectors, having held various cross-functional leadership roles with prominent multinational and Indian original equipment manufacturers (OEMs). His domain expertise encompasses Strategic Sourcing, Project Management, Operations, Process Excellence and Quality Management.

JNV Group operates as a vital industrial partner to global automotive OEMs and Tier-1 suppliers, offering solutions across cars, commercial vehicles, two-wheelers and three-wheelers and the agricultural sectors. The company operates 20 manufacturing facilities in India and 3 dedicated technical centres.

The Group's automotive sector business framework comprises a diverse network of operating companies including – Sujan ContiTech AVS, Polyrub CooperStandard FTS, WBTL India, JNV Gold, Polyrub Plastics, Mega KLC Polymer Technologies, CGS and Intrenio.

Vijay J Sujan, Director, JNV Group, said, “I am thrilled to welcome Sandeep Jad to the JNV Group. His appointment comes at a crucial time as the group evolves with a new portfolio and moves into new areas such as mechatronics. Our vision includes diversifying into braking systems, including ADAS, as well as suspension products and solutions. We aim to create enduring value for customers and be among the Top 50 companies in the automotive parts vertical.”

Sandeep Jad, added, “I am excited to join JNV Group at a time when Indian automobile industry is going through big technological transformation. As we look to the future, my priority will be to build upon the legacy and at the same time focus on delivering greater value to our customers by offering them best technologies and a range of new products.”

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JK Fenner (India) has announced the appointment of Jegapriyan Govindarajan as the company's new President. Based out of Chennai, he will report directly to Vikrampati Singhania, Vice-Chairman & Managing Director of JK Fenner.

Govindarajan comes with nearly three decades of industrial and automotive sector experience to the role, with a professional track record of leading business transformations and profitable growth across both domestic and multinational organisations.

Prior to joining JK Fenner, Govindarajan served as the Managing Director & General Manager (India) at Garrett Motion Technologies India. His previous executive leadership stints include tenures as Managing Director at Tecumseh Products Company and Valeo Lighting Systems India.

He holds a Bachelor’s degree in Mechanical Engineering from Madurai Kamraj University and a Post Graduate Diploma in Business Management from XLRI, Jamshedpur.

JK Fenner operates a robust manufacturing and research network across India, consisting of 9 state-of-the-art manufacturing facilities and 4 advanced R&D centres. The company's domestic distribution channels establish an all-India market presence, complemented by an international export footprint that spans more than 50 countries.

The company supplies specialised mechanical and industrial components to critical sectors such as steel, cement, power, textiles, agriculture, and automotive original equipment manufacturers (OEMs). Its core product portfolio encompasses – Oil Seals & Hoses; Gearboxes & Geared Motors; Pulleys & Belt Tensioners; Front-End Accessory Drive (FEAD) Systems and Moulded Rubber Products.

Moving forward, JK Fenner is expanding its technical and engineering frameworks to target emerging industrial sectors. The company's long-term strategy focuses on developing components tailored for the electric vehicle (EV) ecosystem, integrating AI and digital technologies into its operations and increasing corporate focuses on environmental sustainability.

Vikrampati Singhania said, “I am confident that Govindarajan will provide strong and adept leadership and steer JK Fenner on a new growth trajectory.”

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FORVIA Clarion Electronics has been awarded four distinct vehicle display supply contracts spanning China, India and South America. The business wins underscore the company's regional footprint and its ongoing commercial relationships with prominent domestic and international original equipment manufacturers (OEMs) across China, India and Europe.

The engineering and development phase for these display programs is scheduled to run from Q2 of 2026 through Q4 of 2027. Mass production and delivery will utilise the company's localised, ‘local-for-local’ manufacturing strategy to maximise operational efficiency and maintain proximity to assembly lines in major automotive markets.

The newly secured business covers multiple digital cockpit and vision technologies, reflecting the ongoing transformation of vehicles into software-defined, connected platforms. The awards comprise large-format display solution, which are designed to provide an immersive, digitally enhanced cockpit experience to satisfy consumer demand for higher-resolution interior interfaces. An advanced digital mirror display program aimed at enhancing driver safety, visibility and vehicle aerodynamics. Two additional display implementations tailored to modular and scalable vehicle platforms across diverse price segments.

As vehicle cockpits evolve, global automakers are increasingly demanding integrated, cost-effective display electronics that offer flexibility and customisation without compromising scalability. These contract wins align with FORVIA’s broader IGNITE corporate strategy, which prioritises technological scaling, system integration capabilities and rapid innovation within the In-Cockpit Experience (ICX) domain.

Yves Dumoulin, Executive Vice-President, FORVIA Clarion Electronics, said, “These wins reflect the trust our customers place in our ability to deliver high-performance electronics across diverse regions, customer profiles and market. They demonstrate how our teams continue to execute with excellence while aligning fully with FORVIA’s IGNITE strategy, focusing our strengths, scaling our technologies, and accelerating innovation for In-Cockpit Experience (ICX). These achievements show that FORVIA Clarion Electronics is not only delivering today but building the foundation for long-term leadership.”

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Automotive component manufacturer Tenneco Clean Air India has announced its financial results for the Q4 and FY2026. The company, which supplies emission controls, powertrains and suspension systems to original equipment manufacturers (OEMs), reported a value-added revenue (VAR) increase of 17.5 percent YoY for Q4 and 12.3 percent for the full fiscal year.

The company said it utilises value-added revenue as its primary performance metric to exclude pass-through substrate costs from its operations.

For Q4, value-added revenue reached INR 14,058 million, up from INR 11,963 million in the corresponding quarter of the previous fiscal year. Earnings before interest, taxes, depreciation and amortisation (EBITDA) for the quarter stood at INR 2,573 million, representing an 18.3 percent margin on value-added revenue. Profit after tax (PAT) for Q4 grew 19 percent YoY to INR 1,668 million, yielding an 11.9 percent margin.

For FY2026, total value-added revenue rose to INR 54,040 million compared to INR 48,904 million in FY2025. Full-year EBITDA reached INR 9,255 million, establishing a margin profile of 18.8 percent. Annual profit after tax concluded at INR 6,044 million, equivalent to a 12.3 percent margin, while return on capital employed (ROCE) increased to 94 percent from 57 percent in the prior fiscal year.

The company's revenue streams are divided across two core business segments:

• Clean Air & Powertrain Solutions: Generated INR 6,905 million in Q4 FY2026 and INR 49,180 million for the full fiscal year.
• Advanced Ride Technologies (ART): Generated INR 7,153 million in Q4 FY2026 and INR 24,885 million for the full fiscal year.

The total cumulative lifetime order book, excluding programs already in active commercial production, reached INR 124,000 million as of 31 March 2026. This order volume encompasses the revenue targets set by management for the fiscal year 2028.

During the fiscal year, Tenneco India secured several development contracts across its operating divisions, including the selection of its advanced suspension system for a vehicle platform by an Indian SUV manufacturer.

Additional contracts were signed with a Japanese passenger vehicle manufacturer for emission systems, a European commercial vehicle manufacturer for aftertreatment solutions and an Indian commercial vehicle manufacturer for an engine platform. The company also executed a technology proof-of-concept for a Euro VII emission control layout with a European truck manufacturer and secured a contract for bearing systems with a Japanese passenger car OEM.

To accommodate current order volumes, the company has approved a total capital expenditure allocation of INR 1,400 million. The investment framework funds the construction of two production sites: a greenfield manufacturing plant for Clean Air Systems located in North India, alongside a greenfield facility for Advanced Ride Technologies located in West India.

Arvind Chandra, Whole-Time Director and CEO, Tenneco India, said, “Over the past few years, the team has worked diligently to build a resilient, diversified and execution led business model. This was clearly demonstrated during the quarter and the year under review. Despite geopolitical headwinds since the end of February 2026 and the incremental overheads associated with becoming a listed entity, the team delivered a FY2026 double-digit topline growth at 12 percent and, more importantly, a strong operating performance with the highest-ever EBITDA margin at 18.8 percent. Supported by a strong and expanding order book, we continue to proactively scale our manufacturing capabilities to meet rising customer demand. In addition to the recently announced expansion in Northern India of INR 710 million, we plan to expand our manufacturing presence in Western India with an investment of INR 690 million, leading to a total of INR 1,400 million. These strategic capacity additions position us well to capture incremental growth opportunities, strengthen customer partnerships and support long term value creation. We recently completed a strategic Proof of Concept with a leading European Truck OEM for a Euro VII–compliant Clean Air solution, thereby strengthening capabilities in advanced emission technologies and readiness for future legislations. Also, we were honoured with the Zero-Defect Supplier Award by Toyota in the ART business, underscoring our commitment to operational excellence. In addition, we secured a strategic entry into the engine bearings business at a leading Japanese OEM, due to superior product technology, better quality and longstanding business relationship across other product verticals. Our H2 FY2026 order book addition stands at INR 60,254 million. Combined with the previously announced H1 order book, net of orders currently under production, the incremental lifetime order book reached INR 124,000 million as of March 31, 2026. This robust order book provides strong revenue visibility covering more than 100 percent of FY28 target revenues underpinning a healthy double-digit CAGR trajectory.”

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