BASF and its partners are set to present two technologies at K 2025 that allow for the recycling of polyamides from end-of-life vehicles. While metal recovery from decommissioned vehicles has been standard for decades, about 200 kilograms of plastic per vehicle are often incinerated. The new technologies aim to change this, especially with upcoming requirements from the End-of-Life Vehicle Regulation (ELVR). Pilot projects show how automotive waste can be used as material and returned to a closed cycle for the car industry.

BASF developed a chemical recycling process that recycles used and contaminated plastic parts – including used oil pans from ZF Group vehicles. The core of the process is depolymerisation, where the long polyamide chains break down into their original monomers. The caprolactam monomer obtained from PA6 is then purified. This removes impurities that would have remained with mechanical recycling and potentially reduced the material's quality and safety.

The material is then repolymerised into high-quality polyamide, which is processed into a compound suitable for demanding car industry components, closing the automotive-to-automotive loop.

"What used to be considered non-recyclable is now the starting point for high-quality new products," said Martin Scheuble, Team Leader Circularity Engineering Plastics at BASF.

ZF Group processed the recycled material into a chassis component for Mercedes-Benz. Tests show that depolymerisation allows for polyamide compounds that can be used without compromising performance or other chemical and physical properties.

"This project highlights the potential of recycled plastic - even for technically demanding applications - and underlines ZF's innovative strength in establishing sustainable material cycles," said Dr. Michael Lohrmann, Director Materials Technology at ZF.

Solvent-based recycling of shredder residue

A second pilot project focuses on recycling automotive shredder residue (ASR) – a mixture of materials left after the removal of mostly metals and glass. Close cooperation with a recycling company, using new sorting and processing technology, has allowed the polyamides to be extracted from this mixture in a largely pure form.

This polyamide fraction was the starting material for a solvent-based recycling process. In this process, the polymer chain is selectively dissolved with a solvent, purified and then reprocessed into PA6 compounds.

Poppelmann manufactured and tested a chain guide rail in series production at Mercedes-Benz using this technology.

"The project impressively demonstrates that solvent-based recycling is a practical alternative for plastics that are difficult to recycle mechanically. It makes an important contribution to the holistic circular economy - from the car back into the car," emphasised Steffen Meyer, Team Leader Production Technology at Poppelmann.

Life cycle analyses (LCA) confirm that both the solvent-based and depolymerisation technologies offer substantial CO2 emission savings compared to both conventional polyamide production and traditional plastic recycling methods like thermal recovery.

BASF offers a range of recycling solutions, stating that targets are achieved only if technologies are used in a complementary manner, depending on the type and availability of waste.

Jana Kragenbring-Noor, Head of Sustainability & Environmental Protection at Mercedes-Benz, explained, "Mercedes-Benz is committed to the use of secondary raw materials in its vehicles today and in the future as part of resource conservation and circularity. To continuously increase the availability of such sought-after secondary materials, the expansion of existing and new recycling technologies is essential."

"We are continuously improving the efficiency of physical methods such as mechanical and solvent-based recycling. In addition, we are convinced that complementary technologies such as chemical recycling, which includes depolymerization, pyrolysis and gasification, are necessary to further promote the circular economy and reduce the plastic waste that still ends up in landfills or is incinerated today, as well as the potential to obtain high-quality recycled plastics," explained, Dr. Martin Jung, President of BASF Performance Materials.

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Visteon Corporation has announced an expanded technology partnership with Mahindra & Mahindra that will see its next-generation SmartCore Pro cockpit domain controller deployed in Mahindra’s XUV7X0 SUV lineup.

Unveiled at CES 2026, the SmartCore Pro builds on the SmartCore system introduced in the Mahindra XUV700 in 2021. The new system integrates cockpit electronics, surround view camera technology and telematics on Mahindra’s Adrenox+ platform. It features a three-display configuration supporting vehicle information, infotainment, ADAS visualisation and connectivity, alongside an integrated 360-degree camera system.

Francis Kim, Vice-President of Global Sales & Commercial Excellence and General Manager for Rest of Asia, Visteon, said, “The automotive industry is shifting from discrete systems to fully integrated digital platforms, and India is among the fastest-moving markets in this transition. This partnership demonstrates how strategic OEM collaboration can accelerate time-to-market for complex technologies while laying the foundation for software-defined vehicles.”

Alongside the Mahindra announcement, Visteon also showcased the production specifications and OEM implementations of its High-Performance Compute solution built on the Snapdragon Cockpit Elite platform. The solution follows Visteon’s collaboration with Qualcomm Technologies announced at Auto Shanghai 2025 and is now being demonstrated with multiple global OEMs.

The High-Performance Compute platform supports centralised vehicle architectures and software-defined vehicle strategies. It enables on-device AI processing, multi-display support, multi-user experiences and personalised cockpit features. The system uses the Qualcomm Oryon CPU, Qualcomm Adreno GPU and enhanced NPU AI performance, while Visteon’s cognitoAI Concierge digital assistant operates using the company’s QWEN 7B model.

Uday Dodla, Vice-President, Product Management, Visteon, said, “This High-Performance Compute solution addresses a critical challenge our OEM partners face as they transition to centralized architectures. By consolidating multiple ECUs into a single, powerful platform, we're enabling automakers to reduce complexity and costs while delivering the sophisticated AI-driven experiences that consumers increasingly expect.”

Mark Granger, VP, Product Management at Qualcomm Technologies, said, “Visteon's demonstration of its High-Performance Compute solution on the Snapdragon Cockpit Elite platform highlights the momentum toward centralized, software-defined architectures that will power the next era of intelligent, connected vehicles.”

Visteon said the platform is designed to support a common architecture across vehicle segments, allowing OEMs to scale features while consolidating electronic control units and supporting long-term cost efficiencies.

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French tier 1 supplier Valeo and Hero MotoCorp, the world’s largest manufacturer of motorcycles and scooters, have inked a strategic partnership for Advanced Rider Assistance Systems (ARAS).

The partnership will focus on enhancing rider safety by introducing advanced sensing, perception and intelligent technologies tailored specifically for two-wheelers across both entry-level and premium segments, including the OEM’s emerging electric mobility portfolio under VIDA. 

As part of the understanding, they will focus on ARAS by leveraging Valeo’s radar and smart camera tech equipped in Hero MotoCorp’s two-wheeler portfolio. This will not only enhance safety for two-wheeler users in India, but is also expected to drive awareness amongst customers globally.

The partners state that they have already achieved success in its proof-of-concept systems designed to protect both riders and pedestrians.

Marc Vrecko, CEO, Valeo’s Brain Division, said, “We are truly excited to partner with Hero MotoCorp to deliver solutions that will significantly enhance rider safety and create a more secure riding experience for millions of people. This collaboration is a key step in our strategy to bring advanced technology to the rapidly growing mobility market in India and globally.” 

Ram Kuppuswamy, COO, Plant Operations, Hero MotoCorp, said, “At Hero MotoCorp, we are redefining the future of mobility by bringing advanced technology to our products. Our partnership with Valeo marks a significant stride in making mobility smarter, safer and more sustainable with next-gen advanced rider assistance systems. Together, we aim to make two-wheeler safety accessible to everyone and set new standards for innovation and protection globally.” 

The ARAS architecture is developed as a digital co-pilot for riders, providing a 360deg safety envelope around the vehicle, it provides real-time sensing and intelligent alerts. It uses a radar-based system that can provide critical information/warnings such as Forward Collision Warning (FCW), Distance Warning (DW), Lane Change Assist (LCA), Blind Spot Detection (BSD) and Rear Collision Warning (RCW).

On the other hand, the vision system uses high-resolution cameras to provide Pedestrian Detection, Lane Detection, Traffic Sign Recognition and Lane Departure Warning.

Through intelligent image processing the system identifies road signs and obstacles, even in low-light conditions. Through the combination of radar and vision system, the two-wheeler encompasses a comprehensive safety system for two-wheeler users.

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SiMa.ai has announced its first integrated capability resulting from a collaboration with Synopsys. The joint solution provides a blueprint to accelerate architecture exploration and virtual software development for automotive Systems-on-Chip (SoCs). These chips support applications including Advanced Driver Assistance Systems (ADAS) and In-Vehicle Infotainment (IVI).

The partnership aims to deliver architectures required for software-defined vehicles. The blueprint allows customers to begin the design and validation of custom AI SoCs and ‘shift left’ software development before silicon is available. This process is intended to reduce development costs and accelerate vehicle time-to-market.

The blueprint provides pre-integrated SoC virtual prototypes and a tool workflow using solutions from both companies.

For Architectural Exploration:

• SiMa.ai MLA Performance and Power Estimator (MPPE): Enables customers to size machine learning accelerator designs for specific workloads.
• Synopsys Platform Architect: Used to model workloads and analyse performance, power, memory, and interconnect trade-offs before RTL design.

For Verification and Validation:

• Synopsys Virtualiser Development Kit (VDK): Facilitates software development using a virtual SoC prototype, which can accelerate vehicle time-to-market by up to 12 months.
• SiMa.ai Palette SDK: Supports machine learning workflows for edge AI applications.
• Synopsys ZeBu Emulation: Delivers pre-silicon hardware and software validation to ensure architectures meet workload requirements.

Krishna Rangasayee, Founder & CEO at SiMa.ai, said, "We are pleased with how well the two teams have worked together to quickly create a joint solution uniquely focused on unlocking physical AI capabilities for today's software defined vehicles. Our best-in-class ML platform, combined with Synopsys' industry-leading automotive-grade IP and design automation software creates a powerful foundation for innovation across OEMs in autonomous driving and in-vehicle experiences."

Ravi Subramanian, Chief Product Management Officer, Synopsys, said, "Automotive OEMs need to deliver software-defined AI-enabled vehicles faster to market to drive differentiation, which requires early power optimisation and validation of the compute platform to reduce total cost of development and time to SOP. Our collaboration with SiMa.ai delivering an ML-enabled architecture exploration and software development blueprint supported by a comprehensive integrated suite of tools significantly jumpstarts these activities and enables our automotive customers to bring next-generation ADAS and IVI features to market faster."

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Chinese display panel manufacturer Tianma recently exhibited its range of automotive technologies at CES 2026. The company’s solutions include LTPS-LCD, AMOLED and MicroLED technologies designed for cockpits.

The centrepiece of the exhibit was the Smart Cockpit 7.0, an automotive interior and dashboard demonstration. It integrates a 49.6-inch curved ACRUS display with 8K resolution and a slidable AM-OLED display using a gear-rack mechanism.

It also presented InvisiVue, a solution that mimics decorative surfaces like wood or metal when inactive and reveals images through a transmissivity layer when powered on.

The 49.6-inch ACRUS curved display uses Corning ColdForm Technology. It features pixel-level dimming with 210,000 zones, achieving a contrast ratio of 100,000:1. The unit’s R3000 curvature is designed to align with the windshield to reduce blind spots and reflections.

Furthermore, Tianma also presented two HUD technologies – a 43.7-inch Ultra-wide IRIS HUD. It uses a Mini-LED display with peak brightness of 10,000 nits for visibility in sunlight. It features an 85 percent NTSC colour gamut and a curved structure designed to match the windshield’s optical path.

Secondly, an 11.98-inch IRIS HUD, which utilises high-luminance PGU technology, delivering 12,000 nits brightness. The module is less than 15 mm thick for integration in compact vehicles and operates at approximately 6 W to reduce thermal load.

The company also introduced a 34-inch dye liquid crystal dimming glass for rear side privacy windows. This technology uses voltage control of liquid crystal molecules to achieve stepless dimming without physical sunshades.

The system provides a response time of less than 300ms for transitions between privacy and transparent modes. It features a wide viewing angle and a grey-black tone to manage glare within the vehicle interior.

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