The global shortage of semiconductors or chips in the aftermath of the Covid-19 led pandemic has eased as per a report by Crisil. A development that led most automakers to cut down production significantly and postpone the launch of new models or to put them to production through 2020, 2021, 2022 and a good part of 2023 has finally eased to iron out any supply chain disruptions that may be there. 

Expected to address and improve predictive demand forecast, the better availability of chips should enable better production schedules. By FY2025-26, Crisil analysts are of the opinion that demand-supply dynamics should be more balance with additional manufacturing capacities getting commissioned. 

With the chips possessing distinct electrical properties that make them the cornerstone of all electronic equipment and devices, it is the auto industry that has come to use them for a variety of functions as automobiles turn increasingly software driven. While the computer and communication equipment (C&C) segment consumes roughly 63 percent of the chips produced, the auto industry consumes roughly 13 percent of them. The other industrial segments consume about 12 percent. 

With new developments such as autonomous and EVs, the use of semiconductors in automobiles is only slated to rise. With passenger vehicles the recipient of most technological innovations ahead of other segments such as two-wheelers, three-wheelers and commercial vehicles, it should not come as a surprise that they consume about 1,500 chips on average – the highest among all automobile types. 

As more advanced electronic features are incorporated, the use for chips increases. The electric passenger vehicles, for example, use almost twice as many chips as internal combustion engine (ICE) passenger vehicles do. The improving supply and slowing demand for computers and mobile phones is therefore looked upon as a blessing in disguise for automobiles and their manufacturers. 

Anuj Sethi, Senior Director, CRISIL Ratings, mentioned, “The chip shortage faced by Indian passenger vehicle makers is easing, with current availability at 85-90 percent of total requirement. The production loss on account of the chip shortage, which had halved to about 300,000 PVs on-year in fiscal 2023, is estimated to have further declined to under 200,000 PVs by the end of September 2023.”

Most passenger vehicle manufacturers are currently operating at near optimal capacity utilisation due to stronger-than-anticipated demand. New orders to be serviced remains high at about 700,000 units at the end of September 2023. 

The easing of chip shortage should help automakers honour new orders with better prediction and faster production. Global automobile demand, severely impacted by the Covid-19 pandemic, made a strong recovery in the latter part of FY2021-22. It caught automobile manufacturers off guard as they had not placed substantial orders for chips. 

The surge in demand for personal computers, laptops and mobile phones, driven by work from home, virtual learning and remote healthcare services, led to a significant chip procurement challenge for the automakers. 

Geographically, the chip ecosystem is skewed, with western nations dominating chip architecture, design, manufacturing equipment, specialised materials and chemicals. Semiconductor fabs1 on the other hand are concentrated in eastern nations, such as Taiwan and South Korea.

Given the criticality of chips in the defense and aerospace industries, the United States and the European Union have offered incentives of about USD 100 billion for localisation of semiconductor fabs. As a result, many global players are slated to spend about USD 360 billion towards setting up new facilities, which would be operational by 2025 and 2026. 

In the Indian context, demand for chips will continue to increase over the medium term, driven by the gradual rise in EV adoption and growing demand for advanced feature-laden ICE vehicles.

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MathWorks, a leading software tools company, recently concluded MATLAB EXPO 2026 today, hosting over 1,300 engineers, scientists and industry leaders to discuss the transition of generative AI, engineering copilots and agentic AI from experimental phases to production-scale deployment.

The event focused on the integration of AI-assisted design and simulation into Model-Based Design workflows across industries such as automotive, aerospace and semiconductors. Discussions highlighted the importance of maintaining engineering rigour, traceability and safety while utilising automated workflows.

At the event, MathWorks leaders Seth Deland and Avinash Nehemiah demonstrated how agentic AI capabilities in MATLAB and Simulink are accelerating simulation-led decision-making and system deployment.

Savyasachi Srinivas, VP at Collins Aerospace, detailed the use of AI-enabled knowledge systems and digital twins to move aerospace products from initial concept through to formal certification.

The event saw a panel discussion featuring representatives from Boeing, Mercedes-Benz R&D India, TCS, HSBC and the Indian Institute of Science addressing the critical need for human oversight and verification when validating AI-assisted outputs in real-world systems.

Also, the event saw technology demonstration including Raftar Formula Racing from IIT Madras, displayed their competition-winning race car designed using MathWorks tools.

The highlight at the UAV Pavilion saw drone and eVTOL (electric Vertical Take-Off and Landing) platforms from Speedgoat, Zmotion Autonomous Systems and Reude Technologies.

Sunil Motwani, Country Manager – Sales and Service – MathWorks India, said, “This year’s MATLAB EXPO reflected growing industry interest in applying GenAI, copilots and agentic AI to engineering workflows in ways that improve productivity while preserving validation, traceability and safety.”

The conference underscored a consistent industry shift: engineering teams are moving beyond basic AI experimentation toward certification-ready systems where AI agents accelerate design and verification while keeping engineers central to the decision-making process.

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Hyderabad-based electric vehicle manufacturer Olectra Greentech has announced the adoption of Dassault Systemes’ 3DEXPERIENCE platform.

The collaboration is designed to create a digitally integrated product development ecosystem, aligning Olectra's engineering processes with global OEM standards.

The 3DEXPERIENCE platform provides a unified environment that connects design, simulation and manufacturing. By implementing this system, Olectra aims to move toward virtual twin technology and model-based engineering, allowing it to validate vehicle designs in a virtual space before physical prototyping.

Key Objectives of the Collaboration:

• Digital Integration: Transitioning from component-level engineering to system-level digital orchestration.
• Accelerated Time-to-Market: Reducing innovation cycles through seamless collaboration between engineering and manufacturing teams.
• Virtual Validation: Using simulation to ensure precision and reduce the need for multiple physical prototypes.
• Scalability: Developing new electric bus and truck platforms capable of meeting international benchmarks.

Mahesh Babu, MD, Olectra Greentech, said, At Olectra, we see the future of mobility being shaped by electrification and digital engineering. As part of our commitment to transforming mobility through accessible innovation and a pragmatic future, we are making significant investments in developing new bus and truck platforms. Our collaboration with Dassault Systemes and adoption of the 3DEXPERIENCE platform will play a vital role in building these to global standards and aligning with global benchmarks. This enables us to move faster, design smarter, and deliver with world class precision. As India accelerates its EV transition, we remain focused on leading in both deployment and engineering excellence.”

Deepak NG, Managing Director, India, Dassault Systemes, added, “Our collaboration with Olectra reflects a forward-looking shift toward integrated, platform-driven innovation, enabling faster, smarter, and more sustainable electric vehicle development. Together, we aim to strengthen the transformation of India’s mobility ecosystem through virtual twin experiences.”

The adoption of the platform comes as Indian manufacturers increasingly shift toward platform-based engineering to manage the complexity of next-generation vehicle architectures and drive sustainable growth in the EV sector.

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India has officially commenced its transition to barrier-less tolling with the live deployment of Multi-Lane Free Flow (MLFF) infrastructure at Manoharpur, Rajasthan and Hyderabad, Telangana.

The initiative is powered by Cron AI’s 3D perception platform, senseEDGE, which allows vehicles to pass through tolling points at highway speeds without stopping.

The deployment, a partnership between the National Highways Authority of India (NHAI) and Cron AI, uses LiDAR-based real-time detection to identify and classify vehicles. Unlike traditional toll plazas, the MLFF gantries capture vehicle dimensions and axle counts to determine toll classes while simultaneously using ANPR for number plate recognition and linking to FASTag RFID accounts.

The system currently handles 30,000 to 35,000 vehicles per day at the initial sites. It is designed specifically for Indian road conditions, the platform manages inconsistent lane discipline and ‘occlusion’ (overlapping traffic) with zero false classifications. The LiDAR technology remains accurate during poor visibility, glare, darkness and high-speed traffic.

Tushar Chhabra, Founder & CEO, Cron AI, said, “India is moving from tolling as a checkpoint to tolling as an invisible layer of national infrastructure. That shift requires the road itself to become intelligent. That is what senseEDGE is built to do, and what is now live on some of India’s busiest corridors.”

The move aligns with the Government of India’s mandate to transition over 1,100 toll plazas to MLFF systems. With the National Highway network expanding to 146,204 km as of March 2025 and FASTag penetration reaching 98 percent, the objective is to eliminate idling, reduce fuel consumption, and lower emissions at tolling points.

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Chinese technology company InfiMotion presented its latest electric drive technologies at the 5th International Forum on Automotive Power Systems held in Songjiang. The event gathered industry experts to discuss the theme of ‘dual carbon drive, diversified win-win.’

The company showcased a dual motor assembly featuring a magnesium aluminium alloy shell, which it identifies as a world first for mass production. The assembly uses a patented 360-degree bidirectional, full oil cooling technology for heat dissipation. According to the organisation, the magnesium aluminium alloy housing reduces weight by 25 percent compared to traditional aluminium versions while maintaining hardness, aiding vehicle range and energy consumption.

InfiMotion also showcased magnetic field adjustable motors, which is intended to reduce no-load drag losses and optimise power consumption.

Furthermore, it also displayed ultra-high speed motors capable of 36,000rpm for high-performance applications and 9-in-1 electronic control units designed to integrate power domain control and reduce drive weight.

During the forum, Xu Zhe, a technology expert at InfiMotion, delivered a speech titled ‘The Era Wave of Cross Integration of Electric Drive Calibration and Data Science.’

The presentation addressed the integration of product technology with data science during the research and development process.

The exhibition resulted in exchanges between InfiMotion and several domestic and international enterprises regarding the production and application of future power systems.

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