Elektrobit and Mobileye have announced the integration of EB corbos Linux for Safety Applications into Mobileye Drive, a system designed for Level 4 autonomous driving. The platform will serve as the technical foundation for vehicle manufacturers and robotaxi vendors.

The collaboration utilises Elektrobit’s safety-compliant operating system (OS) to provide features and field updates for Mobileye’s self-driving architecture.

EB corbos Linux for Safety Applications is an open-source OS solution assessed for compliance with automotive functional safety standards. It has received a technical assessment for ASIL B and SIL2 by TUV Nord, based on ISO 26262 and IEC 61508 standards.

The solution allows manufacturers to use Linux in high-performance computing (HPC) domains, specifically for advanced driver-assistance systems (ADAS) and autonomous vehicles (AV). By utilising open-source software, the companies aim to leverage transparency and innovation speed compared to proprietary systems.

Mobileye Drive is designed to automate vehicle types for applications including ride-pooling, public transport, and goods delivery. The system is powered by the EyeQ System-on-Chip (SoC) and utilises AI-driven computation.

The technology is intended for operation without human intervention within defined areas. Mobileye Drive is currently undergoing testing in locations across Europe and North America, drawing on the company's deployment history in approximately 230 million vehicles globally.

Maria Anhalt, CEO, Elektrobit, said, “Our industry is at a pivotal moment, with carmakers, Tier1 suppliers, and technology companies increasingly joining forces to advance autonomous driving. Working with Mobileye and opening up our cooperation on EB corbos Linux for Safety Applications reflects our commitment to practical, safe, and scalable innovation. Together, we are helping pave the way for the next generation of reliable autonomous driving systems”

Johann ‘JJ’ Jungwirth, Executive Vice-President Autonomous Vehicles, Mobileye, added, “Working together with software innovators in the automotive field like Elektrobit is a key factor in expediting the mass-production of vehicles equipped with the self-driving system Mobileye Drive. Our customers expect to deploy AVs in large numbers in the upcoming years, increasing the importance of system stability and reliability.”

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European auto major Stellantis and American technology company Factorial Inc. have integrated solid-state battery technology into a Dodge Charger Daytona development vehicle and launched a road-testing programme. The initiative represents the first integration of solid-state cells into a Stellantis vehicle and the first automotive application of the technology in North America.

The development vehicle utilises Factorial's Factorial Electrolyte System Technology (FEST), which combines a lithium-metal anode with a solid polymer separator. In validation testing, the cells demonstrated a specific energy density of 375 watt-hours per kilogram (Wh/kg) and achieved a charging transition from 15 percent to 90 percent state-of-charge in 18 minutes. The cells also verified thermal stability across an operational temperature envelope spanning minus 30 degrees to 45 degrees Celsius.

Integrating the solid-state cells into a production-based car required a modification of the vehicle's battery enclosure. Stellantis designed and implemented a patented mechanical architecture to house the cells within the existing pack layout. Engineers also modified the electronic control systems and pack management software to optimise current distribution while satisfying automotive durability and crash safety regulations.

The newly initiated tracking and calibration programme on public roads will evaluate the performance, structural durability and overall safety of the modified pack under real-world driving and charging cycles. The project is a phase within a multi-stage development agreement between the two entities. Factorial, which recently listed on the Nasdaq exchange following a business combination, develops scalable battery technologies and counts Stellantis, Mercedes-Benz, Hyundai and Kia among its strategic investors.

Ned Curic, Chief Engineering and Technology Officer, Stellantis, said, "Battery development is a balancing act. It’s not enough to optimise a single metric. We need a system that delivers real benefits in a real vehicle. This milestone shows we are bringing solid-state batteries closer to our customers with the potential for longer range, faster charging and lower costs. Just as important, FEST’s strong compatibility with lithium-ion manufacturing processes gives us a critical path to scale this technology.”

Siyu Huang, CEO, Factorial, said, "We are deeply honoured to work alongside Stellantis, one of the world's great mass-market automakers, on this STLA Large-based development car. What we have built together, from cell chemistry to pack architecture to enable real-world road testing, is exactly the kind of deep, full-stack collaboration that solid-state has always required. This milestone doesn't just validate FEST; it sets a new bar for what automotive-grade solid-state batteries can deliver and supports the development of future vehicles designed to meet the evolving needs of drivers."

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German luxury carmaker Mercedes-Benz has officially launched large-scale series production of its new high-performance electric axial flux motor at its Berlin-Marienfelde facility.

Founded in 1902, the company’s oldest active manufacturing site is being transformed into a global centre of excellence for high-performance electric motor fabrication.

The compact, high-power-density drive system is making its commercial production debut on the front and rear axles of the new all-electric Mercedes-AMG GT 4-Door Coupe.

Bringing axial flux technology to automotive mass production required overcoming steep engineering barriers. The manufacturing footprint spans approximately 30,000 square meters across three production halls, utilising seven highly automated assembly lines.

The production workflow comprises 98 distinct process steps, including 65 deployed for the first time by Mercedes-Benz and 35 entirely new to the global manufacturing sector. These industrial innovations have generated more than 30 patent applications.

The axial flux motor, rather than using traditional round wire, uses rectangular copper wire to pack more conductive material into a tight space, boosting power density. Mercedes-Benz co-developed a high-speed bending process to shape the wire at tight radii without pinching, wrinkling or breaking the insulation coating.

The coil ends are connected to adjacent wires via ultra-precise laser welding. This delivers minimal, highly localised thermal input to prevent heat damage to surrounding plastic components.

Furthermore, drivetrain plastic parts undergo simultaneous laser transmission welding. To prevent geometric inaccuracies, an AI-driven optical system tracks component placement in real time, locks virtual protection zones over sensitive areas and verifies seal integrity instantly.

During final assembly, the stator is structurally integrated between two heavy, magnet-loaded rotor discs. The line manages massive magnetic pull forces of up to 9 kN (approx. 900 kg), keeping the stator perfectly balanced within the magnetic centre plane under a tight tolerance of less than 0.1 millimetres using micro-frequency control pulses.

The current motor design builds on early prototype architectures from British electric motor specialist YASA, which became a wholly-owned subsidiary of Mercedes-Benz in 2021.

Michael Schiebe, Member of the Board of Management, Mercedes-Benz Group AG (Production, Quality & Supply Chain), said, “With the start of large‑scale series production of the axial flux motor in Berlin‑Marienfelde, we are bringing a pioneering innovation for electromobility into industrial reality. In doing so, we are sending a strong signal of technological leadership, operational excellence and the transformation of the automotive industry in Germany."

Patrick Schnieder, German Federal Minister of Transport, noted, “Mastering the demanding axial flux technology is a major opportunity for the German and European automotive industry. This innovative electric motor helps establish a strong foothold in the premium segment. The start of production of the axial flux motor in Berlin-Marienfelde sends a powerful signal about Germany’s strength as an industrial location. With Mercedes-Benz’s axial flux motor, electromobility gains additional momentum. A decisive factor in the continued success of e-mobility is the availability of charging infrastructure. Through our Charging Infrastructure Master Plan 2030, we support both the considerable commitment of the charging infrastructure industry and the efforts of the automotive industry.”

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NXP Semiconductors has introduced the SAF8444, an automotive radar system-on-chip designed to enable advanced driver assistance systems (ADAS) processing on the sensor itself.

Manufactured using 28-nanometre RFCMOS technology, the single-chip solution operates across the 76–81 GHz automotive radar band to support short-, medium- and long-range sensing. The chip is intended for vehicle platforms, including electric vehicles, where it reduces system costs by simplifying thermal management and vehicle integration.

The system addresses entry-level and economy vehicle lines by integrating hardware components to lower overall bill-of-materials costs. It combines an Arm Cortex-A53 applications processor, an Arm Cortex-M7 real-time core, and NXP’s proprietary Signal Processing Toolbox radar accelerator with digital signal processor support. This architecture allows perception-level processing to occur directly on the radar sensor, reducing the data-load reliance on centralised vehicle compute resources.

The technology is optimised for standard automated safety functions, including adaptive cruise control, autonomous emergency braking, blind-spot detection and park assist. To meet safety criteria such as the Euro NCAP 2030 requirements, which include low-light pedestrian detection, the chip fuses camera and radar data.

Additionally, it features a dual-threaded accelerator to run anti-jamming algorithms and mitigate radio frequency interference in congested environments.

NXP supports the device with an enablement ecosystem that includes radar software development kits, safety frameworks, security components, power management integrated circuits, and networking solutions.

Meindert van den Beld, Senior Vice-President and General Manager, Radar & ADAS, NXP Semiconductors, said, “SAF8444 strengthens our one-chip radar portfolio with a solution that balances performance, power efficiency, and cost. It allows customers to meet tightening safety requirements while reducing system cost—an essential step toward democratizing ADAS adoption.”

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German technology company Bosch has officially introduced its third-generation Silicon Carbide (SiC) semiconductors to the Indian market. The strategic rollout targets the next phase of India's electric vehicle (EV) expansion, shifting the market focus from early adoption toward cost efficiency, longer ranges, and mass-market scaling.

Silicon carbide technology has become a cornerstone of modern EV drivetrains, acting as the primary control mechanism for energy flow within the power electronics system – specifically the inverter. By optimising the conversion of direct current (DC) from the battery into alternating current (AC) for the electric motor, SiC chips directly dictate a vehicle's overall electrical efficiency.

The Gen 3 SiC chips bring several structural and performance improvements over legacy silicon and previous-generation components by delivering around 20 percent higher performance, enabling electric vehicles to achieve extended driving ranges without requiring automakers to increase physical battery pack sizes.

The SiC chips are manufactured using an advanced substrate, which reduces switching energy losses and improves thermal performance. This allows for less complex, more lightweight cooling architectures within the engine bay.

Enhanced miniaturisation allows Bosch to harvest more individual chips per semiconductor wafer, lowering manufacturing cost barriers and making advanced power electronics financially viable for mass-market budget EVs, two-wheelers and commercial fleets.

To date, Bosch has delivered more than 60 million SiC chips worldwide. The multinational engineering firm continues to funnel billions of euros into expanding its global semiconductor fabrication plants to reinforce supply line resilience against global automotive chip shortages.

By introducing the third-generation lineup locally, Bosch aims to establish an end-to-end semiconductor ecosystem in India, backing the government's localized advanced manufacturing and vehicle electrification goals.

Sandeep Nelamangala, Joint Managing Director, Bosch and President of Bosch Mobility India, said, “Our advanced SiC technology is designed to deliver the tangible benefits that Indian consumers demand - longer driving range, faster charging, and lower long-term costs. By making high-efficiency power electronics more accessible, we are helping to unlock the full potential of the EV market, making clean, efficient mobility a reality for everyone in India."

Markus Heyn, Member of the Bosch Board of Management, and Chairman, Bosch Mobility business sector, said, “Our ambition is clear: we want to be a globally leading manufacturer of SiC chips. With our next generation SiC chips, we are helping our customers put even more powerful and efficient electric vehicles onto the road.”

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