Synopsys, in association with 3D Engineering (an Ansys Elite Channel Partner), has inaugurated a new Design Center for Engineering Simulation at the MCCIA Electronic Cluster Foundation (MECF) in Pune.

The facility aims to accelerate access to advanced simulation technologies for MSMEs and be a catalyst for industrial R&D in Tier 2 and Tier 3 cities, industry-academia collaboration and student training.

The Design Center will enhance simulation-led innovation and adoption in electronic product design engineering for MSMEs in automotive, aerospace and defence, electronics and healthcare.

The facility will provide hands-on access to engineering tools in structural analysis, thermal modelling, electromagnetics and digital twin technologies. It is equipped with licensed Ansys (now part of Synopsys) simulation platforms and a high-performance computing (HPC) infrastructure.

The MECF facility is one of the Common Facility Centers (CFCs) approved by the Ministry of Electronics and Information Technology (MeitY), valued at INR 710 million. MECF is promoted by the Mahratta Chamber of Commerce, Industries and Agriculture (MCCIA).

This initiative aligns with India's goals under 'Make in India' and 'Skill India' by enabling simulation-led R&D, accelerating time-to-market for local manufacturing innovations and building a talent pipeline trained in engineering challenges.

It will serve as a dual-purpose hub for skill development and industry consultancy, offering design, simulation services and hands-on training. It will also bridge the cost and resource gap for smaller enterprises by offering discounted access to design tools and expert support.

Mike Yeager, Area Vice-President, Synopsys, said, “Simulation is a foundation of modern engineering, and we believe in making these powerful tools accessible everywhere in India. Our collaboration with 3D Engineering and MECF, supported by the Ministry of Electronics and Information Technology (MeitY), will empower students, startups, and SMEs to leapfrog into next-generation design and innovation.”

Murali Pullela, Area Sales Director, Synopsys, said, “Our collaboration with MECF reflects the company's commitment to empower innovation from silicon-to-systems. By equipping the design center with advanced engineering tools, India’s electronics ecosystem can be strengthened, accelerating product development aligned with global standards.”

Shrikrishna Gadgil, CEO, MECF, said, “MECF helps the industry in their product development cycle from design to certification, which will support the electronics ecosystem in the region. Our vision is to make the region vibrant with innovation, fostering new products and technologies, and establishing it as a hub for futuristic products and a center of technology excellence. We’re committed to bringing world-class technology and infrastructure closer to grassroots engineering talent. For us, this Design Center by 3D Engineering with Synopsys, as the principal partner is not just an investment in infrastructure, but also an investment in people, capability-building, and future innovation.”

Ajay Deshkar, Managing Partner, 3D Engineering, said, “As a long-standing Ansys Channel Partner, we at 3D Engineering are proud to enable this ecosystem where cutting-edge simulation technology meets local ingenuity. This Design Center is a model for how industry partnerships can meaningfully drive regional innovation and contribute to India’s technological self-reliance.”

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HMC E-Valley (HIVE) and KPIT Technologies have signed a Memorandum of Understanding (MoU) to establish an Independent Centre of Excellence (CoE) in Delhi-NCR. The facility will provide design and engineering services for global micromobility and L-category electric vehicle (LEV) manufacturers, including those producing e-bicycles.

The partnership targets the multimodal mobility market, specifically first-mile and last-mile connectivity solutions such as e-scooters. Industry data indicates that over 50 percent of current travel occurs within these last-mile segments.

The collaboration combines manufacturing and software expertise to develop LEV platforms.

As per the understanding, HIVE will manage business development, client engagement, prototyping and manufacturing enablement. While KPIT will lead solutioning, engineering delivery, programme management, design and software systems integration.

The CoE is designed to create end-to-end capabilities for the LEV segment, utilising KPIT’s mobility technology and HIVE’s manufacturing and supply chain infrastructure.

Pankaj M Munjal, Chairman, Hero Motors Company, said, “The light electric vehicle industry is at a pivotal juncture, demanding a fusion of cutting-edge hardware and smart software. This partnership with KPIT is a powerful convergence of those forces, signifying HIVE’s deep commitment to redefining urban mobility by delivering the next generation of high-quality, sustainable micromobility solutions globally.”

Kishor Patil, CEO & Managing Director, KPIT Technologies, said, “The future of mobility, even at the micromobility level, is defined by intelligent software and seamless systems integration. KPIT’s deep domain expertise in mobility technology will be crucial in equipping the Center of Excellence to develop world-class, cost-effective, and safe LEV platforms. We are excited to combine our software leadership with HIVE’s manufacturing excellence to accelerate the journey toward safer, smarter, and cleaner transportation.”

The agreement aims to accelerate the development of LEV solutions for the global market by integrating AI-driven mobility software with scalable manufacturing.

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Harman International, a subsidiary of Samsung Electronics, has entered into a definitive agreement to acquire the Advanced Driver Assistance Systems (ADAS) business from ZF Group for EUR 1.5 billion.

The acquisition includes ZF's automotive compute solutions, cameras, radars and ADAS software. Approximately 3,750 employees across Europe, the Americas and Asia are expected to transfer to Harman upon completion of the deal, which is scheduled for the second half of 2026.

The move is part of Harman’s strategy to transition towards software-defined vehicles (SDV). By combining ZF’s ADAS technology with its own digital cockpit products, Harman aims to develop centralised compute platforms. This architecture is intended to link safety and assisted driving functions with in-vehicle connectivity and intelligence on a shared platform.

The integration is designed to reduce system complexity for car manufacturers (OEMs), allowing for more efficient innovation cycles and the scaling of context-aware vehicle experiences.

Christian Sobottka, CEO and President, Harman’s Automotive Division, said, “The industry is at an inflection point where safety, intelligence, and in-cabin experience must come together through a unified computing architecture. With this agreement, we take a strategic step to expand our portfolio with complementary ADAS capabilities that unlock a new class of cross-domain experiences ranging from perception-informed audio cues to more personalized, situation-aware driving. Combined with Harman’s long-standing automotive expertise and supported by Samsung’s broader technology leadership, this positions us to help OEMs design the next generation of intelligent, empathetic, and connected vehicles.”

Mathias Miedreich, CEO, ZF Group, said, “With Harman, we have found the ideal partner to fully unlock the growth and innovation potential of our ADAS business. At the same time, this deal makes an important contribution to reducing our company’s debt and allows us to focus our resources on the core technologies in which ZF is a global leader.”

Young Sohn, Chairman of the Board at Harman, added, “Since acquiring Harman in 2017, the company has scaled its automotive and audio business from USD 7 billion to more than USD 11 billion today. Adding ZF’s ADAS capabilities builds on that momentum. Harman will further expand its technology foundation to deliver safer, more intelligent, and more intuitive in-vehicle experiences. This acquisition reinforces Harman’s leadership in the industry’s transformation and underscores Samsung’s long term commitment to the future of mobility.”

Following the close of the transaction, Harman will align its engineering and ADAS teams to accelerate the development of next-generation platforms. The companies have committed to maintaining support for existing programmes during the transition period. Carolin Reichert, Chief Strategy Officer of HARMAN, noted that the deal represents a ‘major milestone’ and demonstrated the company's ability to execute a ‘complex carve-out.’

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Pioneer Corporation has announced it will unveil Pioneer Ride Connect, a user experience (UX) solution for motorcycles, at CES 2026 in Las Vegas. The system is designed for the production of connected clusters and relies on software updates to provide features to riders.

The solution is the result of a technology collaboration with HERE Technologies. It integrates the HERE SDK, a cloud-based mapping and navigation kit covering more than 120 countries, to provide location-based services for the global two-wheeler market.

Pioneer Ride Connect incorporates several technologies intended to manage hardware costs and smartphone battery life:

• BLE-based Screen Projection: The system uses Bluetooth Low Energy (BLE) to project map images and service information from a smartphone onto the onboard cluster. This method reduces the processing power required by the motorcycle's hardware and lowers smartphone power consumption.
• HMI and AI Integration: The platform features Voice Tap, a voice-based Human-Machine Interface (HMI) for hands-free operation. Edge AI is used to share real-time traffic, weather and hazard data.
• Global Navigation: Through the HERE SDK integration, the system provides routing and traffic information optimised for motorcycles. It includes an offline mode for use in areas with limited network connectivity.

The development follows a partnership between Pioneer and HERE Technologies established in December 2024. The HERE SDK allows for the development of location-aware applications featuring routing and geocoding services across Android, iOS and Flutter platforms.

Pioneer stated that the integration of these technologies serves as a foundation for providing connected services to two-wheeler manufacturers and riders globally.

Seiji Tanezawa, Executive Officer of Pioneer, in charge of business development and strategic alliances, said, “Pioneer Ride Connect is a revolutionary platform that continuously provides software-based upgrades to motorcycles’ UX. By combining Pioneer’s industry-leading expertise in designing a compelling UX with HERE Technologies’ globally accessible Location Intelligence platform, Pioneer Ride Connect transforms the concept of smarter and safer connected two-wheelers into a tangible reality. I’m delighted to unveil our leading-edge technology and ambitious vision at the upcoming CES 2026.”

Deon Newman, Senior Vice-President & General Manager, Asia Pacific, HERE Technologies, said, "Pioneer’s ‘Ride Connect’ brings a smarter, safer motorcycle experience to life - and we’re proud to power it with HERE SDK. Together, we’re making connected services accessible to riders across global markets, with reliable navigation and motorcycle‑optimised routing that work in dense cities to remote mountain roads. It's a meaningful step forward for connected mobility.”

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Kinetic Watts & Volts (KWV), the electric mobility arm of Kinetic Engineering, has entered a technology partnership with Jio Things, a subsidiary of Jio Platforms.

The collaboration will integrate voice-assisted controls, IoT-enabled digital clusters and connected vehicle technologies into Kinetic’s upcoming electric two-wheeler range.

The partnership aims to deploy a suite of digital features for Indian riders, utilising Jio’s IoT ecosystem, which includes hardware, cloud infrastructure and device management.

The collaboration will introduce several capabilities to the Kinetic EV platform:

• Voice Assistance: Interaction for vehicle functions.
• Smart Clusters: Digital instrument panels providing real-time data and infotainment.
• Telematics: Cloud-based analytics for performance monitoring and diagnostics.
• Fleet Management: Tools for commercial operators to track and manage vehicle assets.

The connected platform will be embedded across future KWV models to provide a standard digital experience across different customer segments.

Ajinkya Firodia, Vice-Chairman & Managing Director, Kinetic Watts & Volts, said, “Kinetic has always stood for democratizing mobility and innovation. With this partnership, we now extend that commitment into digital mobility, bringing voice assistance and connected features to everyday riders, so technology becomes truly intuitive and useful. This collaboration also stays true to our motto of ‘Easy’ a philosophy already visible in practical features such as Easy Key, Easy Flip and Easy Charge; and now strengthened with seamless digital experiences that simplify ownership for our customers.”

Ashish Lodha, President, Jio Platforms, said, “Our partnership with Kinetic exemplifies our vision to build a truly connected automotive ecosystem in India. By bringing Jio’s voice assistance and IoT capabilities to the two-wheeler segment, we are not just upgrading vehicles; we are redefining the interaction between man and machine, bringing the benefits of smart mobility to every Indian rider.”

The partnership seeks to combine Kinetic’s manufacturing experience with Jio’s digital infrastructure to make connected electric vehicles more accessible. Objectives include improving rider safety, increasing digital uptime and providing data analytics for fleet operators.

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